Packaging Substrate Development Engineer
Listed on 2026-08-21
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Engineering
Packaging Engineer, Manufacturing Engineer, Quality Engineering, Product Engineer
Advance Your Career
At AMD, we believe technology has the power to solve the world's most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
Whether you're designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we'll advance your career.
The RoleIn this exciting role you will be leading packaging technology development for supply chain bring up of advanced substrate technologies to support AMD's product roadmap.
The PersonIdeal will have a hands-on approach with excellent oral and written communication skills to communicate ideas to stakeholders and global cross functional teams.
Key Responsibilities- Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors
- Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements
- Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks.
- Partner with product, quality and manufacturing engineering teams to meet various milestones for manufacturability, yield and reliability from concept through NPI.
- Qualify package substrates of new products meeting cost and yield targets.
Experience leading cross functional teams to achieve technology certification, yield/cost reduction initiatives, equipment set up.
Communicating complex technical challenges to executive level/management. Deep knowledge of packaging and board design rules, process flows, materials, and equipment.
Proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate and PCB vendors
Academic CredentialsBS/MS/PhD in solid state physics, Chemistry, Material science, Chemical engineering or equivalent.
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