Product Engineer – II, Senior Product Engineer

• Validate products and test vehicles against specifications
• Develop and optimize manufacturing and test workflows and 2.5D/3D modeling accuracy
• Create Best Known Practices to understand and optimize power, thermal, mechanical, signal integrity, and RF impacts of heterogeneous microsystems
• Contribute to 2.5D and 3D advanced packaging solutions for semiconductor devices
• Develop and support TIE's 3D-ADK (Assembly Design Kit)
• Interpret fab metrology, defect, E-test yield, and silicon-to-simulation correlation data
• Quantify process variation impacts on performance, yield, and reliability
• Drive corrective actions across cross-functional teams and identify root causes of systematic yield and reliability issues
• Perform failure analysis on products manufactured at TIE
• Collaborate with internal and external design teams to ensure package compatibility with semiconductor die and system-level requirements
• Design and execute appropriate DOE studies
• Track industry trends and emerging semiconductor packaging and design-integration technologies
• Define product DFT and DFM requirements and methodologies
• Help define ATE test plans and requirements
• Conduct bench/lab validation and characterization of IC solutions and test structures
• Use data analytics to optimize product yield and reliability
• Own the product lifecycle from bring-up through performance, yield, reliability optimization, and customer qualification
• Collaborate with customers to understand and resolve field failures

• Product Engineer I:
  Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science or relevant field
• Product Engineer II:
  Bachelor’s degree in Electrical Engineering, Semiconductor Physics, Computer Science, Materials Science, and a minimum of three years of relevant industry experience
• Senior Product Engineer:
  Bachelor’s degree in Electrical Engineering, Semiconductor Physics, or Materials Science, and a minimum of ten years of relevant industry experience
• Strong understanding of semiconductor device physics and mixed signal IC behaviors
• Proficient programming skills in Python, MATLAB, C/C++, or Perl for data analysis and automation
• Strong communication and teamwork skills
• Excellent analytical and problem-solving skills and attention to detail
• Ability to thrive in a fast-paced environment and manage multiple projects simultaneously
• For Engineer II or Senior: prior experience in semiconductor design, product engineering, process integration/manufacturing, test, or packaging required
• Relevant education and/or industry experience may be substituted as appropriate
• Applicants must be authorized to work in the United States on a full-time basis for any employer without sponsorship
• Criminal history background check required for finalists
• Resume/CV, three work references with contact information (at least one supervisor reference), and letter of interest required

Demonstrates expertise in semiconductor device physics, product engineering, and advanced packaging solutions, with strong capabilities in data analysis and process optimization. Proficient in managing product life cycles and collaborating with cross-functional teams to enhance yield and reliability.