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Sourcing Manager, Server Mechanicals, Cooling; Starlink

Job in Austin, Travis County, Texas, 78716, USA
Listing for: United States Digital Space LLC
Full Time position
Listed on 2026-09-07
Job specializations:
  • Engineering
    Mechanical Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 180000 USD Yearly USD 120000.00 180000.00 YEAR
Job Description & How to Apply Below
Position: Sourcing Manager, Server Mechanicals, Cooling (Starlink)

the company was founded under the belief that a future where humanity is out exploring the stars is fundamentally more exciting than one where we are not. Today the company is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

SOURCING MANAGER, SERVER MECHANICALS, COOLING (STARLINK)

We are seeking a world-class Sourcing Manager to own end-to-end sourcing strategy, supplier management, and delivery of server-level mechanicals and cooling for SpaceXAI compute and network hardware. In this role you will partner deeply with responsible engineers, thermal engineers, and server mechanical teams to define commodity strategy, craft and optimize statements of work (SOW), aggressively challenge unnecessary specifications and costs, and drive node-level hardware execution at extreme velocity and scale.

You will elevate chassis, cold-plate, and thermal-component relationships into true strategic partnerships that deliver unprecedented on-time delivery, quality, cost efficiency, and flexibility while powering the company's record-breaking cluster deployment cadence. The ideal candidate brings deep expertise in server mechanicals and component-level cooling, thrives in high-ambiguity/high-velocity environments, and turns the server thermal and mechanical supply base into a core competitive advantage and force multiplier for the company's AI infrastructure leadership.

RESPONSIBILITIES:
  • Partner deeply with responsible engineers, thermal engineers, and server mechanical teams to co-define commodity strategy, multi-year technology roadmaps, and approved vendor lists for server mechanics and cooling - chassis, lids, bezels and GPU/accelerator trays; cold plates (CPU, GPU, HBM, NIC, switch ASIC); heat sinks, vapor chambers and heat pipes; thermal interface materials (grease, pads, PCM); server fans and shrouds; node-level liquid loops (tubing, fittings, on-server manifolds, dripless QDs);

    and retention hardware (GPU brackets, CPU ILM/back plates, DIMM clips, NIC brackets) - anticipating SpaceXAI TDP and density requirements 12-24 months ahead
  • Own global sourcing end-to-end for server mechanicals and cooling, including supplier selection, qualification of die-cast / stamped chassis, cold-plate, TIM, and fan suppliers, dual/multi-sourcing on constrained thermal SKUs, capacity reservation, and performance governance to achieve on-time delivery and continuous lead-time compression while supporting the company's aggressive cluster build cadence
  • Define and negotiate transformative SOWs and commercial agreements that rigorously challenge unnecessary specifications, drive value engineering of chassis and cold-plate designs, secure aggressive pricing, dedicated tooling and capacity, and flexibility without compromising thermal resistance, leak, and reliability standards required for the company training clusters
  • Drive continuous cost leadership through should-cost modeling of chassis, cold plates, TIM, and fan assemblies; design-for-manufacturability and design-for-serviceability reviews; specification optimization; and long-term pricing agreements that meaningfully reduce total cost of ownership while accelerating time-to-scale
  • Act as the supplier interface for all RFIs, RFPs, and RFQs; visit chassis, cold-plate, TIM, and fan factories and accurately assess die-cast, CNC, skiving, bonding, leak-test, TIM compounding, and high-volume fan capability, plus financial health and capacity, before awarding NPI and production contracts
  • Monitor global industry trends in accelerator cooling (direct-to-chip liquid, cold-plate materials, TIM reliability, high-TDP air/hybrid), chassis architecture, and quick-disconnect standards; partner with design teams to identify and mitigate sole-source, allocation, and long-lead tooling risk before it hits NPI or mass production
  • Work with supply chain engineers and thermal engineers to develop requirements for both NPI and production phases; drive second-source strategies for cold plates, TIM, fans, and QDs without compromising thermal performance or serviceability
  • Standardize and automate NPI-to-mass-production processes, implement inventory and WIP optimization models (including consignment and just-in-time tailored to the company's build velocity), and establish clear KPIs for cost, quality, speed, leak/thermal yield, and resilience that are reviewed weekly with leadership
  • Lead supplier innovation programs- challenge and collaborate with vendors on higher-performance cold plates, lower-resistance TIM, quieter/higher-pressure fans, faster service loops, and next-generation node-level liquid cooling that accelerate the company's hardware roadmap and reduce total cost of ownership
  • Present value propositions to executives, including those related to contract award, tooling, cost reviews, and critical server-thermal supply issues
  • Build and maintain a world-class supply base through strategic relationships with chassis ODMs, cold-plate and vapor-chamber…
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