Engineering Director - SkyWater Technology Foundry Job Austin area,Texas USA,Engineering

Define the engineering vision and multi-year technology roadmaps aligned with corporate growth, yield scaling, and profitability goals.
Lead and mentor a multi-disciplinary team of engineering managers and individual contributors.
Own the balanced scorecard metrics across all critical fab modules (e.g., Lithography, Etch, CVD/PVD Thin Films, Diffusion, Ion Implantation, CMP, and Metrology).
Maximize overall equipment effectiveness (OEE) by optimizing and ensuring process robustness
Enforce Statistical Process Control (SPC), Lean Manufacturing, and Six Sigma methodologies to aggressively minimize process variability and accelerate defect reduction.
Collaborate directly with the Technology Development (TD) team to seamlessly transfer new process nodes into the fab, accelerating yield-learning ramps while maintaining baseline stability for existing high-volume manufacturing (HVM) products.
Process Window Qualification & Design Rules:
Own the engineering qualification of new process windows, ensuring all structural design rules, metrology requirements, and process-capability indices (Cp/Cpk) are met before releasing new layers to production.
Manage capital expenditure (Cap Ex) budgets and operational budgets (OpEx) for tool capacity expansions and strategic engineering projects.
Direct relationships with major semiconductor OEM equipment vendors (e.g., ASML, Applied Materials, Lam Research, KLA) and manage service contract negotiations.
Maintain zero-compromise adherence to Environmental, Health, Safety, and Security (EH&S) policies, cleanroom GxP protocols, and industrial safety standards.
Ensure data integrity and strict full-material traceability at the individual wafer and lot levels using advanced Manufacturing Execution Systems (MES).
Bachelor’s degree in Chemical Engineering, Electrical Engineering, Materials Science, Mechanical Engineering, Solid State Physics, or a closely related technical field. Master’s degree or Ph.D. is highly preferred.
Minimum of 12–15+ years of direct engineering experience within a high-volume semiconductor manufacturing cleanroom environment.
Minimum of 5–7+ years in a senior engineering management role, with a proven track record of scaling teams and driving complex, multi-million dollar engineering projects.
Extensive hands-on historical technical expertise in at least two core fab modules (e.g., Lithography, Dry Etch, CVD/PVD, or Defect Metrology).
Expert knowledge of semiconductor physics, device architecture, and end-to-end wafer processing workflows.
Deep familiarity with factory automation frameworks, MES software systems (e.g., Siemens Opcenter/Camstar, SiView, PROMIS), and equipment communication protocols like SECS/GEM.
Strong command of data-driven analytics platforms (e.g., JMP, Spotfire, or SQL) used for advanced yield learning and root-cause analysis.

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