Equipment Engineer, Deposition and Thermal Process Development, MicroelectronicsResearch Center

Job Posting Title

Equipment Engineer, Deposition and Thermal Process Development, Microelectronics Research Center

Office of the Vice President for Research

All Applicants

40

Exempt from FLSA

Immediately

Expected to Continue

AUSTIN, TX

General Notes

The Microelectronics Research Center (MRC) laboratories serve users from both universities and corporations across many different fields: electronics, optics, physics, chemistry and astronomy, as well as chemical, mechanical and petroleum engineering. The MRC is more than a clean room with a comprehensive set of advanced nano-fabrication equipment; it is a community of scientists who work together to build advanced technology products and knowledge.

UT Austin offers a competitive benefits package that includes:

• 100% employer-paid basic medical coverage
• Retirement contributions
• Paid vacation and sick time
• Paid holidays

This position will be responsible for ensuring processes and the equipment in the areas of deposition and thermal process are operational and baselined as well as providing support for process integration with lithography and etch areas.

• Own and maintain deposition toolsets (sputtering, evaporation, ALD, CVD, furnaces) to meet uptime, reliability, and performance targets.
• Monitor and optimize key system parameters such as pressure control, gas flow, temperature uniformity, plasma stability (for sputtering), and deposition rate control.
• Perform tool qualification, calibration, and matching to ensure repeatable film deposition across systems.

• Perform advanced diagnostics and root cause analysis for equipment-related issues affecting film quality and system performance.
• Conduct hands‑on troubleshooting and repair, including replacement of electronic boards, sensors, power supplies, vacuum components, and mechanical assemblies.
• Coordinate with vendors on major repairs, upgrades, and preventative maintenance strategies.

• Support development and optimization of thin‑film deposition processes in collaboration with engineers and researchers.
• Establish baseline recipes and process windows for metals, dielectrics, and functional materials.
• Ensure equipment capability aligns with lithography‑defined requirements such as feature size, step coverage, and pattern transfer.

• Utilize and support metrology tools (e.g., ellipsometry, profilometry, SEM, AFM, XRR) to characterize film thickness, uniformity, stress, adhesion, and morphology.
• Correlate metrology data with equipment performance to identify drift, non‑uniformity, or failure modes.
• Maintain a set of electrical characterization systems to support monitoring of electrical quality of films and contacts.
• Support data collection, analysis, and process monitoring using scripting tools where applicable.

• Work closely with researchers, engineers and technicians to align tool performance with process requirements.
• Support downstream integration by ensuring lithography tools meet performance needs for etching, deposition, and liftoff processes.
• Participate in facility planning related to tool upgrades, replacements, and capability expansion.
• Collaborate with other process engineers, technicians, and researchers to support process transfer, yield improvement, and multi‑step process integration.
• Participate in interdisciplinary projects involving lithography, metrology, etching, and deposition.

• Train users on equipment operation, capabilities, limitations, and safety practices.
• Develop and maintain standard operating procedures (SOPs), training materials, and maintenance documentation.
• Provide technical support to researchers for process planning and tool selection.

• Ensure safe operation of deposition systems, including vacuum systems, high‑voltage components, and process gases.
• Maintain compliance with institutional safety standards and cleanroom protocols.
• Participate…