FAB Device Engineer Intern - Summer

NXP's Technology & Operations organization plays an essential role in the company's success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers.

• Primary responsibilities include functional yield enhancement (wafer probe), maintaining and improving parametric process control, developing integration changes to reduce cost or enhance device functionality.

• Should have demonstrated abilities to work independently and work within a team-based project environment. Should have keen interest in problem-solving using electrical testing, physical analyses, and statistical data analyses.

• Specific projects may include a facet of integration development or integration optimization.

• Working toward an Electrical engineering degree is required or in another technical field with related experience (Chemical engineering, Materials science).

• Classroom and/or lab familiarity with some of the following: device parametric extraction methods, discrete device operation (MOS, BJT), microfabrication and unit process integration concepts, key statistical analysis and control concepts, materials analysis techniques, materials metrology operation and techniques.

• Preferable would be previous educational, research, or industrial experience (co-op or internship) applying Solid State Physics, Electrical Engineering, Electronic Materials principles to microelectronics-related tasks.

• Experience in JMP, PROMIS, SQL,Lab View orbench probe characterization is a plus.

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.