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ECAD Librarian and PCB Layout Design

Job in Austin, Travis County, Texas, 78716, USA
Listing for: Celestica
Full Time position
Listed on 2026-09-13
Job specializations:
  • Engineering
    Hardware Engineer, Electronics Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 140000 USD Yearly USD 100000.00 140000.00 YEAR
Job Description & How to Apply Below

Summary

The Lead Engineer, Hardware Design eCAD Librarian is responsible for creating, maintaining, and managing electronic component libraries, ensuring compliance with industry standards, and collaborating with engineering teams to support PCB design processes. This position is a dual role serving as both an eCAD Librarian and a PCB Layout designer; while the primary focus is library management, the position also includes assigned PCB layout responsibilities.

This U.S.

-based role will work closely with our overseas librarian team.

Req

Region:
Americas

Country: USA

State/Province:
Texas

City:
Austin

Summary

The Lead Engineer, Hardware Design eCAD Librarian is responsible for creating, maintaining, and managing electronic component libraries, ensuring compliance with industry standards, and collaborating with engineering teams to support PCB design processes. This position is a dual role serving as both an eCAD Librarian and a PCB Layout designer; while the primary focus is library management, the position also includes assigned PCB layout responsibilities.

This U.S.

-based role will work closely with our overseas librarian team.

#HPS-NA

Detailed Description

Performs tasks such as, but not limited to, the following:

  • Library Management:
    The primary role of an ECAD Librarian involves creating, updating, and maintaining accurate electronic component libraries within the Allegro software platform. This includes managing the lifecycle of components and ensuring that all parts are correctly represented.
  • Complex Board Design:
    Execute the layout, routing, and component placement of high-density, multi-layer PCBs (often 12 to 28+ layers) using advanced CAD software (e.g., Cadence Allegro).
  • High-Speed & Constraints:
    Route high-speed digital, analog, RF, and mixed-signal circuits while strictly adhering to complex design constraints, including impedance control, length matching, and differential pairs.
  • Collaboration with Engineers:
    Work alongside electrical, mechanical, and thermal engineers to optimize component symbols and board layout for form factor, thermal management, and overall system performance. Also handle library audits and resolve discrepancies as they arise.
  • Research and Development:
    Analyze component datasheets, vendor drawings, and high-density package specifications to calculate land patterns optimized for Design for Manufacturability (DFM) and Design for Assembly (DFA).
  • Compliance and Standards:
    Act as a subject matter expert (SME) sharing knowledge on library standards, IPC and JEDEC specifications, and ECAD/MCAD integration best practices across Hardware Product Solutions (HPS).
  • Organization:
    Interface with Product Lifecycle Management (PLM) and component database systems to synchronize component attributes, manufacturer part numbers, lifecycle statuses, and compliance data.
  • Efficiency Improvement:
    Engage with component vendors and library services while leveraging AI tools to streamline symbol and footprint creation. Additionally, utilize advanced AI tools to assist in and automate board layout to improve overall efficiency.
Knowledge/Skills/Competencies
  • Expertise in EDA component library management using Cadence Allegro / OrCAD Design Entry, Altium Designer, or Mentor Graphics Xpedition.
  • Advanced proficiency in IPC standards, specifically IPC-7351 for footprint land pattern geometries and IPC-2221 for PCB design.
  • Hands-on technical mastery of complex component packaging, including fine-pitch BGAs, LGAs, QFNs, high-speed connectors, high-density optical modules, and passive chip arrays.
  • Extensive experience integrating 3D STEP models into PCB footprints for accurate MCAD co-design and mechanical clearance validation.
  • Skilled in working with enterprise PLM systems (e.g., Agile, PTC Windchill, Arena) for Bill of Materials (BOM) management and part lifecycle tracking.
  • Strong command of high-density interconnect (HDI) requirements and DFM/DFA constraints for modern high-speed server and AI hardware.
  • Exceptional interpersonal and presentation skills, with a proven track record of analytical problem-solving and customer-centric service.
  • ATS: This segment serves customers in complex, regulated and high-reliability markets such as Industrial & Smart Energy, Aerospace & Defense, Semiconductor Capital Equipment, and Health Tech. It is engineering led, with deep expertise in design, manufacturing and lifecycle solutions.
  • CCS: This segment focuses on high-performance technology solutions and services for the data center, serving hyperscalers,…
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