Senior Lab Technician; Advanced Rework, Cable Assembly & Test

What you will do

• Perform PCB assembly, soldering, and rework on multilayer boards with fine‑pitch SMT, QFN/QFP, BGA, and MOSFET packages.
• Execute BGA rework (remove/reball/replace) using controlled thermal profiles, preheat methods, and microscope inspection.
• Rework thermal‑pad power devices with proper solder wetting, heat control, and workmanship quality.
• Build prototype cables and wire harnesses from drawings and work instructions (cut, strip, crimp, solder, terminate, label, and strain‑relieve).
• Validate cable assemblies through continuity and pinout checks, and additional verification methods as required.
• Set up and execute electronic test procedures for prototypes using DMMs, oscilloscopes, power supplies, electronic loads, and test fixtures.
• Record test results, compare to acceptance criteria, document failures, and support debug/failure isolation with engineering.
• Operate and maintain 3D printer equipment (FDM/SLA as applicable) to produce fixtures, tools, and prototype parts.
• Prepare, organize, and stage parts kits based on BOM and revision‑controlled build requirements.
• Maintain accurate rework, test, and parts traceability records.
• Enforce lab organization standards, ESD controls, labeling discipline, and workstation readiness.

• 4+ years of experience in electronics lab, prototype, or advanced electronics assembly/rework.
• Demonstrated experience with fine‑pitch SMT soldering and BGA rework.
• Proven experience soldering/reworking power packages, including MOSFETs.
• Hands‑on experience with prototype cable/harness assembly and verification against schematics/pinout documentation.
• Hands‑on experience executing electronic test plans and accurately documenting results.
• Minimum working expertise with IPC‑A‑610 Class 2 workmanship criteria, including inspection and accept/reject decisions.
• Ability to read schematics, assembly drawings, wiring diagrams, and BOMs.
• Strong organizational skills and attention to detail in parts kitting and lab workflow.

• Current or previous IPC certifications: J‑STD‑001, IPC‑A‑610, IPC‑7711/7721, IPC/WHMA‑A‑620.
• Experience with X‑ray‑assisted BGA verification or external inspection workflows.

• Engineering lab environment requiring frequent microscope‑based, fine‑pitch hand assembly.
• Cross‑functional collaboration with electrical, mechanical, and test engineering teams.
• Ability to handle and move light lab equipment and materials as needed.

The pay range for this position is $29 to $43 per hour. This pay range may be modified in the future. The successful candidate’s starting pay will be determined based on job‑related skills, experience, education or training, work location, and market conditions. This position is also eligible for bonus, equity, and benefits.