Manager, Technical Project​/Program Management – SmartStart Mayan Automation

SPG Mayan Automation – Engineering Manager

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT.

If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

The SPG Mayan Automation – Engineering Manager leads Mayan-based automation initiatives supporting tool installation and the warranty phase, working in close partnership with SPG BU Intelligence, Engineering, Quality, and Field organizations. This role combines deep technical leadership with disciplined program execution to improve installation consistency, reduce warranty exposure, and drive scalable automation across factory and field operations.

• Lead and develop a team of engineers responsible for Mayan automation programs across SPG BUs, ensuring alignment with business priorities and install/warranty objectives.
• Own end-to-end execution of Mayan automation for installation and warranty programs, from problem identification through deployment and benefits realization.
• Partner with BU Intelligence and Install/Warranty stakeholders to identify install pain points, warranty drivers, repeat nonconformances, and cost‑reduction opportunities.
• Oversee development and continuous improvement of test plans, Mayan scripts, diagnostics, and troubleshooting workflows to improve system reliability and reduce field labor.
• Drive test automation, modularization, and standardization of testing, execution, and reporting.
• Support and scale Smart Start automation initiatives to improve install consistency, quality, and cycle time.
• Track savings, benefits realization, and continuous improvement metrics.

• Develop and manage end-to-end program plans, including scope, schedule, risks, dependencies, and deliverables.
• Communicate program status, risks, and mitigation plans clearly to cross-functional stakeholders and leadership.
• Define, track, and report KPIs such as install efficiency, defect escapes, repeat issues, and warranty cost trends.

• Provide installation readiness support and lead program adoption and usage tracking across factory and field teams.
• Enable field success through training materials, documentation, and structured knowledge transfer.
• Participate in customer-site engagements as needed to assess install risks and customer-specific requirements.

• Strong understanding of semiconductor capital equipment systems (mechanical, electrical, pneumatic, vacuum, and process subsystems).
• Demonstrated passion for test automation and efficiency improvement.
• Experience with system installation, testing, diagnostics, and troubleshooting.
• Familiarity with manufacturing and operational systems such as SAP, iOMS, Smart Factory, Mayan, or equivalent platforms.
• Strong analytical and data-driven decision-making skills.

• Proven project and program execution discipline.
• Structured problem solving and root-cause analysis.
• Clear, effective communication across matrixed and cross-functional organizations.
• Ability to operate effectively in fast-paced, ambiguous environments.
• Customer-focused mindset with a strong orientation toward continuous improvement.

• Bachelor's degree in Engineering or a related technical discipline.
• 5–7 years of experience in technical program management, manufacturing, installation, or field support (semiconductor or capital equipment experience preferred).
• Experience leading cross-functional and matrixed teams.
• Willingness to travel 10–30%, including international travel.

• Improved installation quality, consistency, and cycle time.
• Reduced warranty cost and repeat defect occurrence.
• Effective translation…