Senior or Principal Technical Program Manager

Senior or Principal Technical Program Manager

Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative.

Our mission is to advance the state of the art in 3D heterogeneous integration (3

DHI), chiplet-based architectures, and multi-component microsystems—catalyzing breakthroughs across microelectronics, artificial intelligence, quantum computing, high-performance computing, and next-generation healthcare devices.

Backed by $1.4 billion in combined funding from DARPA, Texas state initiatives, and strategic partners, we are building foundational capabilities in advanced packaging and integrated design infrastructure to restore U.S. leadership in microelectronics manufacturing.

TIE's 3

DHI and chiplet integration platforms integrate novel thermal management and advanced interconnect solutions to deliver unprecedented performance and energy efficiency. Operating at the intersection of defense electronics and commercial markets, TIE offers a rare opportunity to reimagine an industry from the ground up and build transformative products with global impact.

UT Austin, recognized by Forbes as one of America's Best Large Employers, provides outstanding employee benefits and total rewards packages that include:

• Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
• Voluntary Vision, Dental, Life, and Disability insurance options
• Generous paid vacation, sick time, and holidays
• Teachers Retirement System of Texas, a defined benefit retirement plan, with 8.25% employer matching funds
• Additional Voluntary Retirement Programs:
  Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
• Flexible spending account options for medical and childcare expenses
• Robust free training access through Linked In Learning plus professional conference opportunities
• Tuition assistance
• Expansive employee discount program including athletic tickets
• Free access to UT Austin's libraries and museums with staff
• Free rides on all UT Shuttle and Austin Cap Metro buses with staff

This role leads complex multi-disciplinary initiatives that drive innovation in microsystems technology. By orchestrating collaboration across internal teams and external partners, it ensures strategic alignment, timely execution, and clear communication of progress. The position also plays a key role in shaping program direction through industry insight and proactive problem-solving.

• Lead the planning, execution, and delivery of cross-disciplinary programs supporting TIE's advanced microsystems roadmap.
• Develop and manage program scopes, schedules, budgets, and risk mitigation plans to ensure predictable delivery across engineering and manufacturing teams.
• Coordinate efforts across internal R&D, process development, design automation, and partner organizations to align execution with technology and business objectives.
• Serve as the central liaison between TIE's technical teams, university researchers, and external stakeholders—including DoD partners, national labs, and commercial collaborators.
• Drive metrics-based accountability and communication across all program tracks to ensure transparency and stakeholder confidence.
• Identify dependencies, anticipate bottlenecks, and proactively resolve issues to maintain momentum in a fast-moving environment.
• Support the generation of technical documentation, customer deliverables, and integration roadmaps that communicate progress and align with contract requirements.
• Monitor industry trends in advanced packaging, 3
  
  DHI, and chiplet-based architectures, informing program direction and partnership strategy.
• Other related functions as assigned.

• Industry
  
  Experience:
  
  8+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development, with a deep understanding of the advanced packaging ecosystem and market trends.

• Industry
  
  Experience:
  
  10+ years of experience in semiconductor packaging, microsystems integration,…