N2 Photo Equipment Technician

Responsibilities

• Perform scheduled and unscheduled maintenance in the ATMC Photolithography Equipment area.
• Maintain, repair, upgrade, and monitor wafer fabrication equipment, including troubleshooting and repair for ASML TWINSCAN, ASML 5500, TELACT8, LITHIUS, and LITHIUS PROZ.
• Perform maintenance on electrical/electronic, pneumatic, and mechanical systems, scheduled maintenance, consumable changes, and various other activities relevant to area success.
• Complete documentation and train others on equipment maintenance.
• Effectively communicate using written and verbal skills.
• Stand for long periods (up to 12 hours), occasionally stoop or crawl in confined spaces.
• Lift and carry objects up to 50 pounds.

• Preferred: AS or AAS in electronics, industrial engineering, or related. Equivalent experience may satisfy the requirement.
• Minimum 8 years of experience in the semiconductor industry, or an equivalent combination of education and experience.
• Minimum 5 years of technical maintenance experience in the Photolithography area.
• Strong verbal and written communication skills.
• Excellent problem‑solving skills.
• Solid understanding of SPC and FDC, and ability to use these controls to improve overall equipment performance.
• Ability to interact and communicate with all Operations and Engineering personnel.
• Capability to interface with other internal and external groups to ensure safety, performance, and reliability requirements are satisfied.

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.