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Software Engineering Director​/Architect, DIC P&R & AI-driven EDA Automation

Job in Austin, Travis County, Texas, 78716, USA
Listing for: Cadence
Full Time position
Listed on 2026-07-19
Job specializations:
  • Software Development
    AI Engineer (Applied/Software), Python
Salary/Wage Range or Industry Benchmark: 120000 - 160000 USD Yearly USD 120000.00 160000.00 YEAR
Job Description & How to Apply Below
Position: Software Engineering Director/Architect, 3DIC P&R & AI-driven EDA Automation

At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

We are looking for a Software Engineer to help build scalable EDA flows and AI-driven automation for advanced 3

DIC applications. This role will focus on developing robust flow-generation capabilities, debugging assistance, root-cause analysis, and platform integration for 3

DIC, interposer, and RDL system flows.

Core Responsibilities
  • Build scalable EDA flows using C++, Tcl, Python, and Java.
  • Develop AI/LLM-based automation for 3

    DIC applications, including flow generation, debugging assistants, and root-cause analysis capabilities.
  • Integrate 3

    DIC flows into a broader platform system supporting 3

    DIC, interposer, and RDL system flows.
  • Design and automate workflows that improve usability, productivity, and debug efficiency for complex package and system-level design challenges.
  • Collaborate with cross-functional engineering teams to define requirements, validate flow behavior, and deliver production-quality solutions.
Required Skills
  • Strong background in EDA data structures and algorithms.
  • Hands‑on experience with Tcl, Python, and C++ automation in EDA tools.
  • Experience with DB‑driven design flows, such as Innovus or similar implementation platforms.
  • Understanding of 3

    DIC, interposer, packaging routing, and RDL design flows.
  • Knowledge of constraint‑driven design, including timing, signal integrity, DRC, and related implementation constraints.
  • Experience handling large‑scale design problems, including high bump‑count designs and multi‑region routing challenges.
Preferred Skills
  • Experience with 3

    DIC, 3.5D, or 2.5D designs.
  • Familiarity with signal integrity, EMIR, and thermal considerations in advanced packaging environments.
  • Experience with LLM or AI systems, including agent frameworks and prompt‑to‑script automation.
  • Knowledge of multi‑tool integration and end‑to‑end flow automation.
  • Ability to translate complex EDA workflows into scalable, user‑friendly automation solutions.
Education and Experience
  • Bachelor’s or Master’s degree in Computer Science, Electrical Engineering, Computer Engineering, or a related technical field.
  • Relevant industry experience developing EDA software, design automation flows, AI/LLM‑enabled engineering tools, or advanced packaging design solutions.

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