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Senior ASIC Packaging Automation & AI Engineer (Hybrid

Job in Austin, Travis County, Texas, 78716, USA
Listing for: Advanced Micro Devices
Full Time position
Listed on 2026-08-02
Job specializations:
  • Software Development
    AI Engineer (Applied/Software)
Salary/Wage Range or Industry Benchmark: 120000 - 180000 USD Yearly USD 120000.00 180000.00 YEAR
Job Description & How to Apply Below
Position: Senior ASIC Packaging Automation & AI Engineer (Hybrid)

Advanced Micro Devices (AMD) is seeking a highly motivated engineer to support the package design organization with AI-driven automation workflows. You will accelerate the design of advanced heterogeneous integration technologies through automation and AI-enabled methodologies.

The role requires translating complex design challenges into scalable automation solutions, collaborating across Design, EDA, and AI/ML teams, and delivering high-quality results with limited supervision.

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Position Requirements
10+ Years work experience
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