Sr. Mechanical Engineer, Annapurna Labs, Machine Learning Hardware

Sr. Mechanical Engineer, Annapurna Labs, Machine Learning Hardware

Annapurna Labs (our organization within Amazon) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world.

As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large-scale server deployments in a continuous effort to deliver a world‑class customer experience. This is a fast‑paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas.

You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products’ performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

• Design and build the systems that are the heart of the world's largest and most powerful computing infrastructure.
• Develop solutions from circuit design to large system design and see those systems all the way through to high volume manufacturing.
• Shape the machinery that goes into our cutting‑edge data centers, affecting millions of AWS users.
• Demonstrate and deliver products that meet performance, quality, and cost goals.

• BS or MS degree in Mechanical/Thermal Engineering.
• 10+ years industry experience in Mechanical and Thermal design of Systems.
• Experience in thermal and performance measurements and characterization on SoCs, Servers, and Systems.
• 3+ years of experience in SoC Thermal modelling and IC package transient thermal response.
• Experience with Chip package, System Mechanical & Thermal design for air‑cooled and liquid‑cooled systems.
• Collaborate effectively with teams spanning multiple sites and develop detailed specifications for product teams to use.
• Work with ODMs, heatsink vendors, and internal design teams on cross‑boundary triaging, debugging, and resolving issues across organization.

• Knowledge of SoC thermal/mechanical design methodology, power modeling and thermal analysis techniques.
• Tool familiarity:
  Ansys Icepak, Flo Therm, Cadence Celsius, PTC Creo, and Solidworks.
• Programming experience:
  Bash, Shell, Linux, Python, and Lua.
• Working knowledge of fans, valves, chillers, and CDUs.
• Knowledge of various types of technologies for heatsink solutions, thermal interface materials (TIMs) and liquid cooling technologies.
• Develop detailed CFD and compact RC models for SoC and package thermal analysis.
• Knowledge of hardware and software based thermal/power management control algorithms.
• Optimize thermal solutions under PPA and system design constraints.
• Simulate and prototype thermal control strategies.
• Validate thermal models through power/thermal measurements on hardware.

Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.