Principal​/Senior Principal Electromechanical Design Engineer

Position

Principal / Senior Principal Electromechanical Design Engineer

Linthicum, Maryland (100% on-site)

Relocation assistance may be available

Travel may be required up to 10% of the time

Secret clearance required. Current or active DoD Secret clearance is not required, but final clearance must be obtained prior to start.

• Design, prototyping and production support of state-of-the-art RF, digital, and mixed signal multi‑chip modules (MCMs), printed wiring boards (PWBs), and circuit card assemblies (CCAs) using various substrate materials and chip‑scale packaging technologies
• Collaborate within a cross‑functional integrated product team (IPT); communicate effectively with peers in adjacent functions including electrical design, systems engineering, thermal analysis, structural analysis, drafting, supply chain management and manufacturing
• Organize and prioritize tasks to accomplish project milestones within schedule and budgetary constraints
• Provide technical leadership and mentoring to less experienced personnel

• Bachelor’s degree with 5 years of experience OR master’s degree with 3 years of experience OR PhD with 1 year of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related fields (or 4 years of applied experience in lieu of degree)
• U.S. citizenship required
• Ability to obtain/maintain a DoD active Secret clearance (final clearance required prior to start)
• Experience with PWB/CCA design and signal routing, including chip‑scale packaging technologies and substrate PWB layout
• Working knowledge of materials, specifications, manufacturing processes and design tools for multi‑chip modules, PWBs and CCAs
• Proficient with AutoCAD and/or Xpedition software
• Familiarity with NX or other 3D modeling software

• Bachelor’s degree with 8 years of experience OR master’s degree with 6 years of experience OR PhD with 4 years of experience in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related fields (or 4 years of applied experience in lieu of degree)
• U.S. citizenship required
• Ability to obtain/maintain a DoD active Secret clearance (final clearance required prior to start)
• Experience with PWB/CCA design and signal routing, including chip‑scale packaging technologies and substrate PWB layout
• Working knowledge of materials, specifications, manufacturing processes and design tools for multi‑chip modules, PWBs and CCAs
• Proficient with AutoCAD and/or Xpedition software
• Familiarity with NX or other 3D modeling software

• Advanced degrees in Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related fields
• Current/active DoD Secret Clearance or higher
• Proficiency with ASME Y14.5 geometric dimensioning and tolerancing (GD&T) and ASME Y14.100 engineering drawing practices
• Familiarity with thermal and structural analysis concepts, methodologies and software tools
• Experience with hands‑on assembly and testing of prototype electronic hardware
• Experience in a technical leadership role on a cross‑functional product development team
• Experience routing RF signals

• Health plan
• Savings plan
• Paid time off and additional benefits including education assistance, training and development
• 9/80 work schedule (where available)

Primary Level Salary Range: $ - $

Secondary Level Salary Range: $ - $

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit