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Principal​/Sr Principal PCB Producibility Engineer

Job in Baltimore, Anne Arundel County, Maryland, 21276, USA
Listing for: Northrop Grumman Corp. (AU)
Full Time position
Listed on 2026-07-21
Job specializations:
  • Engineering
    Electronics Engineer
Salary/Wage Range or Industry Benchmark: 108800 - 203600 USD Yearly USD 108800.00 203600.00 YEAR
Job Description & How to Apply Below

Relocation assistance may be available.

Clearance required for start:
Yes – Clearance type:
Secret. Travel:
Yes, 10% of time.

Job Overview

Principal or Senior Principal PCB Producibility Engineer based out of Linthicum, MD.

Key Responsibilities
  • Provide engineer support for the design of complex RF, Digital, Mixed Signal, and Power PCBs through all design phases. Advise on material selection, define stack-up, perform impedance calculations, and review routing rules.
  • Conduct Design for Manufacturing (DFM) reviews to ensure PCB designs are producible and meet yield, cost, schedule targets.
  • Review PCB documentation for fabrication concerns, including drawings, parts lists, and electronic data.
  • Serve as liaison between internal design teams and PCB fabricators for quotes, technical questions, revision notices, and issue investigation.
  • Collaborate with cross‑functional teams (design, Global Supply Chain, PCB Category Management, and PCB Fabricators) to support PCB sourcing strategy and supplier readiness reviews.
  • Assist with PCB layouts, from component placement to routing, creating multi‑layer board designs that meet signal integrity, power distribution, and EMC requirements.
  • Build strong relationships with internal and external PCB fabricators and designers to understand capabilities, industry standards, and technology trends.
Basic Qualifications – Principal PCB Producibility Engineer
  • Bachelor’s Degree with 5 years experience or Master’s degree with 3 years experience or Ph.D. with 1 year experience in Science, Technology, Engineering, Mathematics or related fields. Additional 4 years of experience may be considered in lieu of a degree.
  • U.S. citizenship required.
  • Ability to obtain/maintain an Active DoD Secret Clearance.
  • Minimum of 5 years PCB Producibility, PCB design or fabrication experience in a high‑volume or high‑complexity environment (digital, mixed‑signal, or RF).
  • Minimum of 3 years experience with automated DFM review tools (Valor NPI, Genesis, CAM
    350, and Polar).
  • Minimum of 3 years working knowledge of IPC 2221, IPC 6012 & 13, IPC 7351, and GD&T for PCB design.
Basic Qualifications – Senior Principal PCB Producibility Engineer
  • Bachelor’s Degree with 8 years experience or Master’s degree with 6 years experience or Ph.D. with 4 years experience in Science, Technology, Engineering, Mathematics or related fields. Additional 4 years of experience may be considered in lieu of a degree.
  • U.S. citizenship required.
  • Ability to obtain/maintain an Active DoD Secret Clearance.
  • Minimum of 8 years PCB Producibility, PCB design or fabrication experience in a high‑volume or high‑complexity environment (digital, mixed‑signal, or RF).
  • Minimum of 5 years experience with automated DFM review tools (Valor NPI, Genesis, CAM
    350, and Polar).
  • Minimum of 5 years working knowledge of IPC 2221, IPC 6012 & 13, IPC 7351, and GD&T for PCB design.
Preferred Qualifications – Principal/Senior PCB Producibility Engineer
  • Current or active DoD Secret clearance.
  • Expert working knowledge of PCB design, IPC Standards, PCB fabrication processes and equipment.
  • Familiarity with blind/buried vias, sequential lamination, and rigid‑flex processes.
  • Expert in PCB fabrication tools such as Valor NPI, Genesis
    200, CAM
    350, and Polar.
  • Experience developing design tools and scripts (Python, C/C++, Valor NPI).
  • Expert knowledge of Circuit Card Assembly manufacturing.
  • Expert working knowledge of the Mentor Xpedition software suite.
  • Experience with complex RF/microwave PCB design or high‑speed digital design (≥5

    Gbps).
  • Experience with advanced PCB Technology such as High‑Density Interconnect (HDI) and/or Ultra HDI material and processing.
  • Experience working directly with advanced high‑complexity PCB fabricators.
  • Willingness to travel to PCB Fabricators and Material Suppliers for technical collaboration.
  • Familiarity with 3‑D mechanical integration tools (Solid Works, NX, Enovia).
  • Flexibility and willingness to deal with diverse requirements and complex trade‑offs, often outside industry standards.
  • Familiarity with Root Cause Correction Action (RCCA) methodology.
  • Demonstrated success working in collaborative, fast‑paced development teams.
  • Ability to work in a dynamic environment
Position Requirements
5+ Years work experience
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