Associate Research Scientist; PREP
Listed on 2026-06-30
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Research/Development
Research Scientist -
Engineering
Research Scientist
PREP Research Associate – CHIPS Project
PREP Research Associate
CHIPS Funded Project
This position is part of the National Institute of Standards and Technology (NIST) Professional Research Experience (PREP) program, which supports collaboration between NIST research staff and academic institutions on mutually beneficial projects. Employees in this role will perform technical work that underpins the scientific research of the collaboration.
Research
Title:
Physicist (CHIPS Project:
Accurate Cure Kinetics, Stress, Mechanical Properties and Warpage Measurements for Next-Generation Microelectronics Packaging under Device Relevant Conditions)
U.S. Citizen Preferred
Key responsibilities:
- Plan, design, and characterize the performance of advanced microscopes based on Brillouin scattering, Raman scattering, and fluorescence lifetimes.
- Characterize the mechanical properties of complex polymeric materials using these microscopy methods.
- Collaborate with a multi-disciplinary team working to characterize, test, and model polymeric materials relevant to semiconductor packaging applications.
- Participate in the characterization of the mechanical properties of candidate research‑grade test materials.
- Publish results in refereed scientific journals and present results at scientific conferences and meetings.
Qualifications:
- Ph.D. in physics, chemistry, materials science, or related discipline.
- Background in Raman and Brillouin light‑scattering techniques, including expertise in instrumentation development.
- Background in fluorescence lifetime microscopy, including experimental experience in both time‑ and frequency‑domain methods.
- Experience in the use of microscopy techniques for the measurement of viscoelastic properties of polymeric materials.
- Strong data‑analysis and Python programming skills for processing large datasets, fitting models, and producing publication‑quality figures.
- Track record of technical writing (peer‑reviewed papers, technical reports) and communicating results to mixed audiences.
- Demonstrated ability to lead projects, mentor students/postdocs, and coordinate cross‑functional collaborations.
- Ability to work on‑site in a laboratory setting in Gaithersburg, MD and meet all safety/training requirements.
Employment Type: One‑year appointment
Location: Gaithersburg, MD
This role focuses on integrating 3D machine‑vision systems with robotic arms to support manufacturing applications and to develop new metrics and standards for these systems.
Duties:
- Integrate robot arms and commercial bin‑picking systems into the NIST/ISD bin‑picking testbed.
- Program collaborative robot arms for conducting various tasks and experiments.
- Research the effects of factors such as part color, surface properties, bin color, bin depth, part‑size ratio, and part distribution on bin‑picking performance.
- Collect data from various 3D imaging systems.
- Design and develop 3D‑printed artifacts and optimize 3D printer parameters for improved print quality.
- Use metrology systems (laser trackers, CMMs, etc.) for establishing reference measurements.
- Use analysis software (Python, MATLAB, Spatial Analyzer, Polyworks, Excel, etc.) to interpret results and produce visualizations.
- Assist in the development of demonstrations for trade shows and conferences.
- Write reports and contribute to peer‑reviewed publications.
Employment Type: Full‑time (40 hrs per week)
Location: Gaithersburg, MD
Salary Range: Based on Johns Hopkins University guidelines (actual compensation may vary).
Equal Opportunity EmployerThe Johns Hopkins University is committed to equal opportunity for all applicants. We do not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity or expression, veteran status, or any other legally protected characteristics.
For more information about our equal‑opportunity policies, see EEOC Guidance.
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