Development Engineer

IC Package Development Engineer (Germany)

The automotive industry is at a turning point with advanced chiplet technology paving the way for autonomous driving and connected vehicles. Imec and the State of Baden-Württemberg are establishing a joint project to support the local and international automotive industry in derisking and accelerating the introduction of automotive chiplets into manufacturing.

In our new Advanced Chip Design Accelerator (ACDA) competence center, based at the Innovation Park AI (IPAI) in Heilbronn, we will be pushing the boundaries of what's possible and accelerating the future of automotive. By leveraging imec's world-leading expertise in semiconductor technology and packaging, we will be building the chiplet-based solutions that will power the vehicles of tomorrow to be smarter, safer, and more efficient.

Your assignment consists of the following tasks:

• Package Selection and Analysis Select an appropriate IC package type based on the given specifications and IC requirements. Perform a comprehensive analysis of the chosen package's electrical characteristics. Identify any limitations or potential issues that may arise during the design process.
• Electrical Performance Optimization Optimize the electrical performance of the IC package by focusing on signal integrity, power integrity, and electromagnetic compatibility (EMC). Analyze the routing, parasitic effects, and noise issues associated with the package. Propose design modifications or enhancements to improve electrical performance.
• Design for Manufacturability and Cost Optimization Consider manufacturability and cost optimization aspects of the IC package design. Review the design for compatibility with manufacturing processes, assembly requirements, and materials availability. Suggest design modifications to streamline the manufacturing process while maintaining or reducing overall costs.
• Documentation and Reporting Produce a comprehensive report summarizing your analysis, design modifications, and optimization recommendations for the IC package. Include detailed diagrams, simulations, calculations, and experimental results where applicable. Clearly communicate the rationale behind your design decisions and their potential impact on the IC's performance and reliability.

We offer you the opportunity to join one of the world's premier research centers in nanotechnology at its office in Heilbronn, Germany. With your talent, passion and expertise, you'll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

• MSc in the field of electronics & equivalent with at least 5 years of experience in packaging design as well as SIPI analysis
• Knowledge in Cadence layout tools
• Knowledge in Ansys simulation tools
• Knowledge in 2.5D/3D packaging, backend silicon layout (place & route)
• To be able to communicate in English is a must