Advanced Packaging Process Engineer, Silicon Technology; Starlink

Advanced Packaging Process Engineer, Silicon Technology (Starlink)

Bastrop, TX

Space

X was founded under the belief that a future where humanity is exploring the stars is more exciting than one where we are not. Today Space

X is actively developing the technologies to make this possible, with the ultimate goal of enabling human life on Mars.

Space

X is leveraging its experience building rockets and spacecraft to deploy Starlink, the world’s most advanced broadband internet system. Starlink is the world’s largest satellite constellation, providing fast, reliable internet to millions of users worldwide. We design, build, test, and operate all parts of the system – thousands of satellites, consumer receivers that allow users to connect within minutes of unboxing, and the software that brings it all together.

In true Space

X fashion, Starlink is taking the next step in vertical integration by bringing advanced silicon packaging and assembly in-house for development and manufacturing. We are looking for hands‑on, dynamic engineers with expertise in semiconductor packaging design, process development, equipment, and testing. You will assume full ownership of packaging products and process modules and take them from concept to mass production as we strive to make Starlink more affordable.

• Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer‑level and chip‑level systems
• Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next‑generation panel‑level packaging processes
• Bring‑up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
• Own packaging prototypes, product development, and release to production
• Select equipment and material to meet quality, reliability, cost, yield, and production targets
• Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
• Cross‑functional interface with silicon design, materials, thermal, systems, and production teams
• Implement advanced packaging solutions into Space
  
  X next generation products on Earth, in orbit, and beyond

• Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline
• 1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable)

• Advanced technical degree
• 3+ years industry experience with microelectronics packaging development
• Hands‑on packaging, PCB, PCBA, or SMT assembly experience
• OSAT (outsource semiconductor assembly and test) experience

• Ability to work extended hours or weekends as needed for mission‑critical deadlines
• To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful permanent resident (green card holder), (iii) refugee under 8 U.S.C. § 1157, or (iv) asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State

Space

X is an Equal Opportunity Employer; employment with Space

X is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Applicants wishing to view a copy of Space

X’s affirmative action plan for veterans and individuals with disabilities, or applicants requiring reasonable accommodation to the application/interview process should reach out to .