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Microelectronics Advanced Packaging Engineer

Job in Beavercreek, Greene County, Ohio, USA
Listing for: Booz Allen Hamilton
Part Time position
Listed on 2026-06-04
Job specializations:
  • Engineering
    Manufacturing Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 61900 USD Yearly USD 61900.00 YEAR
Job Description & How to Apply Below

Microelectronics Advanced Packaging Engineer The Opportunity

Applies engineering physics, engineering mathematics and materials science principles to support the design, analysis, manufacture or maintenance of mechanical systems. Applies specific functional knowledge and working and general industry knowledge. Develops or contributes to solutions to a variety of problems of moderate scope and complexity. Works independently with some guidance, and reviews or guides activities of junior employees.

You Have
  • 2+ years of experience in dynamic manufacturing and R & D environment evaluating new packaging materials, processes, and architectures to align to state‑of‑the‑art
  • Experience in eCAD and mCAD software
  • Experience with packaging, PCB fabrication, cleanroom processing, or SMT assembly
  • Experience developing packaging solutions that optimize Size, Weight and Power (SWaP) and prototyping designs in a high‑mix, low‑volume R & D environment
  • Experience operating and maintaining complex equipment in microelectronics rapid prototyping laboratories
  • Experience with the complete packaging assembly processes from concept to prototype, including equipment and material selection for panel‑level, wafer‑level and chip‑level systems
  • Experience with flip‑chip, BGA, WLP, system‑in‑package (SiP), multi‑chip modules (MCM), panel‑level packaging, heterogenous and chiplet integration
  • Ability to obtain Secret clearance
  • Bachelor's degree in an engineering field
Nice If You Have
  • 5+ years of experience with advanced packaging technology innovation and prototyping
  • Experience collaborating with RF, digital, photonics, and analog designers to tailor packaging designs to application needs
  • Knowledge of trends related to current technology, including future technologies, design or prototyping for DoD systems
  • Secret clearance
  • Master's degree in an engineering field
Clearance

Applicants selected will be subject to a security investigation and may need to meet eligibility requirements for access to classified information.

Compensation

At Booz Allen, we celebrate your contributions and provide health, life, disability, financial, and retirement benefits, paid leave, professional development, tuition assistance, work‑life programs and dependent care. Full‑time and part‑time employees working at least 20 hours a week are eligible for the benefit programs. The projected compensation range for this position is $61,900.00 to $ (annualized USD). The posting will close within 90 days of the posting date.

Work

Model
  • Remote:
    If this position is listed as remote, there may still be occasions when you are required to work in person at a Booz Allen or customer facility.
  • Hybrid:
    If this position is listed as hybrid, you will be expected to work from a Booz Allen facility frequently, and may also need to work from or visit a customer facility.
  • Onsite:
    If this position is listed as onsite, work will primarily be performed at a Booz Allen office or customer facility.
Commitment to Non‑Discrimination

All qualified applicants will receive consideration for employment without regard to disability, status as a protected veteran or any other status protected by applicable federal, state, local, or international law.

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