Senior Process Integration Engineer

Overview

We are seeking a highly organized and detail-oriented Process Integration Engineer to support Manufacturing Operations by optimizing and transferring existing 0.18um Mixed Signal and BCD manufacturing processes, driving cross-functional teams to resolve technical issues, and interfacing with internal and external customers. This role includes ownership of analog/mixed-signal device processing, parametric testing, and defect analysis for legacy and new technology products.

• Process Ownership & Technology Transfer

  • Provide technical ownership of BiCMOS and BJT-focused manufacturing process flows, including transferring processes from foundry to internal manufacturing site

  • Execute and support tape-out activities for transferring legacy and new semiconductor products into the Beaverton fab.

  • Review and interpret source GDS, mask lists, MT-form data, and validate against internal process flows and PDK structures.

  • Ensure correct layer generation, scribe selection, die-size matching, test-line placement, and alignment with established flow requirements.

  • Identify when new modules, process options, or flow changes are needed and work with cross-functional integration teams to develop and enable them.

• Manufacturing Support & Yield Improvement

  • Lead engineering teams to investigate and resolve yield, defect, and parametric performance issues.

  • Optimize manufacturing processes through design of experiments (DOE) and systematic data analysis.

  • Evaluate and disposition wafers and lots based on electrical test results and inline parametric data.

  • Drive Corrective and Preventative Actions (8D processes) to address root cause and prevent recurrence.

• Serve as a technical interface between Process Integration, Module Engineering, Manufacturing, Quality, and external foundries.

• Communicate clearly and effectively in high-visibility situations with executive management, key customers, and auditors.

• 5+ years experience as a semiconductor Process Engineer or Process Integration Engineer.

• Master’s degree or above in Electrical Engineering.

• Strong technical foundation in wafer fabrication processes, including:

• Photolithography

• Chemical Mechanical Polishing (CMP)

• Diffusion

• Chemical Vapor Deposition (CVD)

• Wet and dry etch

• Rapid Thermal Annealing (RTA)

• Ion implantation

• Epitaxial growth

• Metallization

• Demonstrated knowledge of semiconductor device physics, particularly CMOS and BJT technologies.

• Strong communication skills with the ability to remain composed, clear, and effective in challenging or diverse situations.

• Working knowledge of statistical process control (SPC) and applied statistics.

• Strong attention to detail with proven root‑cause analysis capability.

• Basic familiarity with failure analysis methodologies.

• Experience with foundry tape-out flows (TSMC or similar).

• Experience with foundry NPI, including troubleshooting tape-out and process-transfer issues.

• Background in IC wafer fabrication engineering, semiconductor materials, manufacturing systems, and wafer electrical test.

• Job Req Type:
  Experienced

• Travel:
  Yes, 10% of the time

• Shift Type: 1st Shift/Days

• The expected wage range for a new hire into this position is $95,600 to $131,450.

• Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.

• This position qualifies for a discretionary performance-based bonus and includes medical, vision and dental coverage, 401k, paid vacations, holidays, sick time, and other benefits.