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Cleanroom Assembler

Job in Bedford, Middlesex County, Massachusetts, 01730, USA
Listing for: AMETEK, Inc.
Full Time position
Listed on 2026-07-02
Job specializations:
  • Manufacturing / Production
    Quality Engineering, Production QC/QA
Salary/Wage Range or Industry Benchmark: 50000 - 60000 USD Yearly USD 50000.00 60000.00 YEAR
Job Description & How to Apply Below

Responsibilities

  • Operating manual wire bonds and other cleanroom equipment; setting up, calibrating, and operating manual wire bonders to perform ball or wedge bonds with meticulous control.
  • Precision wire bonding and assembly: carefully manipulate and position the work holder under the bond head, forming the first and second bond under a microscope.
  • Adjust bonding parameters (e.g., bonding force, power, temperature, time, ball size, and height) as needed.
  • Quality control and inspection: inspect components and wire bonds under a microscope to ensure compliance with quality standards and specifications; identify and troubleshoot defects such as damaged components, missing traces, wire breaks, and non‑sticking bonds.
  • Perform routine maintenance on manual wire bonding machines, troubleshoot minor equipment malfunctions, and report more complex issues to appropriate personnel.
  • Adhere to strict cleanroom procedures, electrostatic discharge (ESD) safety protocols, and company policies to maintain a clean and safe work environment.
  • Collaborate closely with engineers, quality assurance technicians, and other assembly team members to ensure smooth production flow and high‑quality output.
  • Provide flexibility to be trained in multiple processes and utilize excellent electro‑mechanical assembly skills to build, assemble, and test products.
  • Maintain familiarity with FOD prevention and management.
Qualifications and Skills
  • High school diploma or equivalent, often coupled with vocational training or an associate degree in electronics or a related technical field.
  • Previous experience in a manufacturing or cleanroom environment is highly desirable, particularly operating manual wire ball and/or wedge bonding equipment and substrate/microchip mounting.
  • Strong manual dexterity, hand‑eye coordination, attention to detail, and ability to work with precision tools and microscopes.
  • Familiarity with manual bonding techniques (ball bonding, wedge bonding, ribbon bonding) and an understanding of different wire materials (gold, copper, aluminum) and their properties.
  • Experience with bond pull testers and other inspection tools is a plus.
  • Soft skills:

    attention to detail, problem‑solving, patience, focus, and the ability to follow detailed instructions. Good written and verbal communication skills are also important for effective collaboration and documentation.
  • Experience with oven brazing, laser marking, laser welding, and sealing components is preferred but not required.
Compensation

Employee Type:
Hourly

Currency: USD

Salary Minimum: 50,000

Salary Maximum: 60,000

Incentive:
No

Disclaimer:
Where a specific pay range is noted, it is a good faith estimate at the time of this posting. The actual salary offered will be based on experience, skills, qualifications, market/business considerations, and geographic location.

Equal Opportunity Employer

We are an Equal Opportunity Employer and do not discriminate against any employee or applicant for employment because of race, color, sex, age, national origin, religion, sexual orientation, gender identity, status as a veteran, and basis of disability or any other federal, state, or local protected class. Individuals who need a reasonable accommodation because of a disability for any part of the employment process should call 1 .

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