Advanced 3D Packaging – Platform Integration Lead

Advanced 3D Packaging – Platform Integration Lead

IC-Link by imec is a complete solutions provider that can manage the full product lifecycle– serving start-ups, SMEs and established OEMs as well as universities. Our highly experienced ASIC development team realizes over 600 successful tape-outs per year across all our supported technologies (CMOS, GaN-on-SOI and Si photonics). We are enriching this offering by adding IMEC’s technologies such as Photonic Integrated Circuits and 3D packaging to our portfolio of solutions.
Backed by imec, one of the world’s leading R&D labs in nanoelectronics, IC-Link offers tailored services adapted to customer needs – from ASIC design including radiation-hardened designs to package development, testing and qualification.

• Our 3D packaging technologies are offered through prototyping and manufacturing services to our customers, either in IMEC’s fab or at volume manufacturing partners.
• Your mission is to lead the development of the IMEC’s 3D Packaging Integration platform in IMEC’s (future) fabs. You make sure that the process modules, integration flow and test solutions needed to realise key building blocks such as, Silicon Interposer, scaled microbumps, Redistribution layers, Trough Silicon Vias, Die to Wafer and Wafer to wafer, are developed towards manufacturing purpose
• In order to do so, you follow-up on test vehicles and customer’s fab’s program. You make sure that PDK and ADK are created and regularly updated according to our industrialisation plans
• You ensure that those items are compatible with a broader supply chain:
  Testing and OSAT, with whom we operate in our ecosystem. You make sure that our platform technology is compatible with manufacturing practices
• You are familiar with wafer scale 3D integration and unit steps. You are experienced in discussing technical issues with the fab engineering teams (internal and external), while at the same time being capable of presenting our roadmap externally.
• You keep your level of technical know-how up to date and benchmark imec’s expertise and performance in your domain with the rest of the world.
• You join the IC-Link sector as part of IMEC’s silicon Technology office. Good communication and interaction with the supporting expertise centre sand supply chain (Fab, Integration, Design and Tape Out, test and reliability).
• You represent imec in contacts with third parties and representatives for semiconductor players from around the globe for matters that relate to your field of expertise. You are involved in technology transfers to 3rd parties.
• You operate from imec’s HQ located close to Brussels in the heart of Europe.

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

• You are a seasoned semiconductor technologist/engineer (with a master degree or a PhD) with >10 years relevant experience in a semiconductor foundry environment. A background in 3D/Advanced packaging wafer integration flow is a requisite; a good knowledge of EDA systems is a plus.
• You are familiar with OSAT and can interface with them.
• You are able to adapt to imec’s fast evolving environment where different TRL of different technologies co‑exists in the same manufacturing line.
• You have excellent communication skills and can…