Modelisation of light matter interaction for temporary bonding applications
Listed on 2026-09-12
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Research/Development
Modelisation of light matter interaction for temporary bonding applications
Master internship – Leuven (Posted more than two weeks ago)
As the semiconductor industry pivots from traditional node scaling toward system‑level innovation, temporary bonding and debonding of wafers is a key step for next industrial development. This internship focuses on improving a technique that enables the use of standard Si wafers as temporary carriers, offering a low‑cost and process‑friendly solution.
Internship type
:
Master internship
Duration
: 6 months
Required educational background
:
Materials Engineering, Physics, Nanoscience & Nanotechnology
University promoter
:
Clement Merckling (KU Leuven)
Reference code
: 2026-INT-147
Imec allowance will be provided for students studying at a non‑Belgian university.
Responsibilities
- Model the interaction between infrared laser light and debonding stack to support heat‑based debonding.
- Simulate laser absorption, predict temperature evolution, and identify process conditions that allow reliable, selective release of the device wafer.
- Guide the development of a robust and efficient laser‑assisted temporary bonding approach.
Qualifications
- Currently enrolled in a Master program in Materials Engineering, Physics, Nanoscience or Nanotechnology.
- Strong analytical and modeling skills.
- Interest in semiconductor process integration.
Application instructions
- resume
- motivation letter
- current study details
Incomplete applications will not be considered. For further information or for application, contact Francois Chancerel () or John Slabbekoorn ().
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