Senior Applications Engineer – Semiconductor 3D X-ray Solutions

Senior Applications Engineer – Semiconductor 3D X-ray Solutions

As an Applications Engineer, you will join an exciting and growing team of scientists, engineers, and research professionals, focused on advancing 3D X-ray solutions for semiconductor applications. You will collaborate closely with customers and internal teams to enable cutting-edge inspection, metrology, and failure analysis workflows.

Key Responsibilities

• Lead system demonstrations for semiconductor customers, including fabs, FA labs, and R&D centers
• Develop new applications and methodologies tailored to semiconductor devices, processes, and packaging technologies
• Provide critical input to product development by informing system specifications based on customer needs and application gaps
• Deliver advanced customer training on system operation, data acquisition, and analysis workflows
• Design, develop, and optimize robust workflows for semiconductor inspection and analysis
• Perform tool characterization, benchmarking, and baseline performance studies for semiconductor use cases
• Serve as a technical leader in customer-facing support activities, including:
• Delivering high-impact technical presentations and demos
• Supporting industry conferences and trade shows
• Authoring technical papers and presenting at conferences

Customer Base

Our customers include semiconductor manufacturing facilities (fabs), failure analysis (FA) laboratories, and advanced R&D organizations working at the forefront of device innovation.

Role Impact

In this role, you will act as a key technical interface between engineering, sales, and marketing, serving as the voice of the semiconductor customer. You will partner with external clients and internal development teams to:

• Establish best-in-class workflows for routine semiconductor inspection and analysis
• Identify and unlock new applications of 3D X-ray technology across front-end and back-end processes
• Solve high-value problems (HVPs) related to yield, reliability, process development, and advanced packaging

Essential Qualifications

• BS or MS degree in a relevant technical field (e.g., Materials Science, Physics, Electrical Engineering, or related discipline)
• 3–5 years of experience in a semiconductor-related field (e.g., fabs, failure analysis, metrology, or process development)
• Hands-on experience designing experiments, analyzing data, and delivering results in a commercial or customer-facing environment
• Ability and willingness to travel up to 30% (domestic and international)

Preferred Qualifications

• Background in microscopy or advanced imaging techniques (e.g., X-ray CT, SEM, FIB)
• Working knowledge of X-ray absorption principles and imaging/optical fundamentals
• Experience with semiconductor capital equipment, particularly in inspection, metrology, or FA workflows
• Familiarity with advanced semiconductor technologies (e.g., 3D IC, heterogeneous integration, advanced packaging)

Additional Information

Time Type:
Full time

Employee Type:
Assignee / Regular

Travel:
Yes, 25% of the Time

Relocation Eligible:
No

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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