Sr. Wafer Fab Engineer

Location:

Billerica, MA, 01821

Job Function:
Engineering R&D

Job Country:
United States

Job City:
Billerica

Job Type: Regular Full Time

Excelitas is a global technology leader focused on delivering market-driven solutions in illumination, optical, detection and imaging across multiple sectors. Our Billerica facility specializes in advanced photonics products based on MEMS and other micro-scale optical devices.

We are seeking a Sr. Wafer Fab Engineer to support and advance our Wafer Fab R&D Engineering team, focusing on silicon-based MEMS fabrication process. You will develop deep expertise in our processes, work closely with Manufacturing to drive continuous improvements, lead expanding efforts in compound semiconductor fabrication, develop wet etch processes for GaAs and InP, and serve as the primary technical liaison to external foundries.

Additionally, you will own wafer bonding initiatives and evaluate external partners for prototyping and long-term production support. This position offers cross-disciplinary impact across silicon MEMS, III‑V materials, and advanced packaging domains.

• Develop and support wafer fabrication processes for MEMS, VCSELs, micro‑optics, and PICs.
• Lead all advanced fabrication R&D projects in our on‑site cleanroom.
• Work with Manufacturing to identify areas of improvement in the fabrication process to reduce scrap.
• Track variation and process capability throughout the value stream, identify and support continuous improvement initiatives.
• Support Ni‑electroplated microstructure production.
• Implement, document, and maintain in‑process routings, work instructions, tool trainings, tests & specifications.

• Minimum BS in Electrical Engineering, Materials Science or a related discipline is required.
• 5+ years industry experience for candidates with BS, 4+ years of industry experience for candidates with MS, 3+ years of industry experience for candidates with PhD is desired.
• Experience with semiconductor process technologies including photolithography, dry etch, wet etch, metal PVD, and PECVD is required; MEMS device fabrication experience is strongly desired.
• Experience with wafer bonding techniques with a strong understanding of substrate constraints, thermal budgets, and alignment schema.
• Strong working knowledge of fabrication metrology techniques including optical microscopy, optical & stylus profiling, and SEM.
• Familiarity with Ni electroplating is preferred but not required.
• Self‑motivated with the ability to work independently and in a team environment.
• Strong organizational and problem‑solving skills.
• Basic understanding of DOE and SPC concepts is highly desired.

• Pay Range: $120,000 - $160,000 annually, depending on experience.

The position requires the use of information which is subject to the International Traffic in Arms Regulations (ITAR).

Visa sponsorship is not available for any position at Excelitas.

Excelitas is an Equal Opportunity Employer and encourages applications from minorities, females, people with disabilities, veterans, gender diverse individuals, and people of sexual orientation.