Principal FEOL Technology Development Engineer

Job Summary

Contribute to development, transfer, optimization, and documentation of overall process flow and macro modules required to fabricate reliable, manufacturable Power Trench MOSFETs and BCD (BiPolar‑CMOS‑DMOS) devices. Characterize, evaluate, and document semiconductor devices to ensure reliability and performance to quality standards. Evaluate new opportunities for development and/or transfer of new semiconductor technology and processes.

• Set up and perform process and device simulations to determine initial process parameters, capabilities, and direction for optimization of new process flows.
• Design and perform experiments and analyze results to determine process sequences and parameters that yield target device parameters, using simulations or initial test lots as starting point.
• Analyze data (electrical, in‑process measurement, or visual inspection) from fabrication of test lots to identify parameters requiring additional optimization.
• Work with Process Engineering to develop, characterize, and optimize process modules.
• Support processing of initial test chip and transfer lots fabricated with the new process to identify and correct problem areas and achieve first‑pass success.
• Provide inputs to and work with Device Engineers to develop layout rules for the developing process, using equipment specifications and experimental data.
• Recommend test structures and contribute to layout of test chip mask sets to aid in new process development and evaluate process‑dependencies of device parameters.
• Provide weekly, monthly, quarterly development updates to upper management and external customers.
• Support company initiatives such as quality, safety, environmental management, CQI, 5S, yield management, and cost containment.

• Strong knowledge of key front‑end process modules (Silicon, Epi, Diffusion, Etch, Photo, Thin Films, etc.).
• Process integration experience in CMOS/BCDMOS or Discrete IGBTs/MOSFETs.
• Strong knowledge of silicon semiconductor device physics.
• Experience in process flow design to achieve manufacturability metrics and meet electrical test targets.
• Experience with and understanding of electrical test data and its correlation to process and cross‑sectional data.
• Experience interpreting failure analysis results and familiarity with failure analysis techniques.
• Experience with power packaging, including assembly and reliability issues.
• Experience in backend (BGBM, STM, etc.) processes.
• Experience in development of process, technology, and design FMEAs.
• Skills in DoE design and data analysis tools (JMP, Spotfire).
• TCAD process simulations.
• Reading and interpreting design layouts.
• Ability to work and interpret information/data between design and process teams, drive solutions, and collaborate with cross‑functional teams.
• Technical leadership, strong education, experience, and communication skills.

Typically requires a Masters or PhD in Electrical Engineering, Physics, or Material Science and 5+ years of experience in a relevant job function.

Salary: $125,000–$165,000. Benefits include health, dental, vision, disability, life insurance, 401(k) plan with company match, paid time off, annual bonus, and tuition reimbursement.

Polar Semiconductor is an Equal Opportunity Employer and prohibits discrimination and harassment of any kind. We are committed to the principle of equal employment opportunity for all employees and to providing employees with a work environment free of discrimination and harassment. All employment decisions are based on business needs, job requirements, and individual qualifications, without regard to race, color, religion, sex, sexual orientation, gender identity, age, national origin, disability, veteran status, or any other status protected by the laws or regulations in the locations where we operate.