Sr. Engineer - Chemical Mechanical Polish

About Our Group

At Seagate, our mission is to build the world’s best data storage devices. The Advanced Transducer Development group is a global R&D organization dedicated to developing new recording head technologies to advance areal density and support Seagate’s HDD (Hard Disk Drive) product roadmap for the next four years and beyond.

• Support the development of Chemical Mechanical Polishing (CMP) processes to achieve planarity, surface quality, and dimensional targets in advanced head devices.
• Assist in maintaining process stability by analyzing data for statistical process control and supporting investigations of process excursions.
• Support configuration, qualification, and scheduling activities for CMP equipment.
• Work with engineering partners to understand device requirements and support alignment between process outputs and design intent.
• Collaborate with cross‑functional wafer process teams (lithography, deposition, etch, wet process, and integration) to support integration of CMP processes into development builds.
• Analyze data and report results related to process performance and downstream impact.
• Support interactions with equipment suppliers to assist with process and hardware improvements.
• Participate in activities related to technology transfer to product engineering teams.
• Contribute to technical documentation and support knowledge sharing across the team.

• You are self‑motivated and interested in developing your technical expertise in a manufacturing and R&D environment.
• You are able to work with guidance while handling multiple assignments and priorities.
• You collaborate effectively with engineers and technicians across teams.
• You are detail‑oriented and able to document and communicate results clearly.
• You are interested in learning new processes, tools, and technologies.
• You are comfortable working in clean room and laboratory environments.

• Bachelor’s degree in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or a related field with 5+ years of experience, or a Master’s degree with 3+ years of experience, or a PhD with 0+ years of experience, or equivalent experience.
• Working knowledge of CMP fundamentals, including slurry chemistry, pad interactions, and material removal concepts.
• Experience supporting semiconductor or wafer fabrication processes.
• Familiarity with thin‑film or nanostructure characterization techniques (e.g., AFM, SEM, ellipsometry, or similar).
• Experience analyzing data and applying basic statistical methods.
• Experience supporting or operating process equipment in an R&D or manufacturing environment.
• Ability to work with data and contribute to problem‑solving activities.

• Exposure to advanced characterization techniques or analytical tools.
• Experience with statistical tools such as JMP or similar.
• Familiarity with semiconductor process integration or advanced wafer technologies.
• Exposure to process development or R&D environments.

$92,310.00 - $, based on work location and other factors.

• Eligibility for discretionary bonus program.
• Medical, dental, vision, and life insurance.
• Short‑ and long‑term disability coverage.
• 401(k) retirement plan.
• Employee stock purchase plan.
• Health savings account.
• Dependent care and health‑care spending accounts.
• Paid time off, including 12 holidays, flexible time off, minimum of 48 hours paid sick leave, and 16 weeks paid parental leave.

Normandale, United States.

Up to 10%.