Sr. Wafer Process Development Engineer

About our group

You will have the exciting opportunity to work on cutting edge technologies and help push the areal density of Seagate recording heads beyond that of any other competitor in the world. This is a Development Engineer position in our wafer process development team. Our team's mission is to develop new processes for state‑of‑the‑art recording head technology. Recording head process technology encompasses all disciplines employed in semiconductor wafer processes technology, performed in a clean room environment.

• Develop robust and manufacturable wafer processes to achieve critical dimension and geometry of nanometer-scale devices for advanced recording heads.
• Assume ownership of the wafer process module.
• Work with a team of engineers in various processes to deliver advanced writers with designed magnetic, electrical, and thermo‑mechanical performance for the next generation products.
• Manage experiments/projects and wafer tracking aggressively and deliver results to the designated schedule.
• Participate in hands‑on investigation and resolution of process issues with frequent factory‑floor presence.
• Interact with design and product teams to understand design requirements and CTQs for device performance.
• Participate in the technology transfer to the production team.

• Self‑motivated, independent worker with demonstrated strong work ethic and potential for long term growth.
• Capable of fast learning and adapting to the changing needs of a fast‑paced development program.
• Teamwork across functional teams/departments.
• Clear written and verbal communication of results and issues.
• Strong attention to details and clean execution.

• Bachelor's degree in engineering related field (i.e. Electrical, Mechanical, Chemical, Computer Engineering, Materials, Physics, or Information Technology) and 5+ years of experience or master's degree in the same and 3+ years' experience or PhD and 0+ years' experience or equivalent experience and education.
• Knowledge or industry experience in semiconductor fabrication.

• Hands‑on experience or knowledge of vacuum and/or thin film process technologies including Ion‑mill, ICP, IBD, CVD, MBE, and ALD.
• Understanding of the fundamentals and applications of plasmonics.
• Experience working in a clean room.

Our Normandale campus spans two suburbs, Edina and Bloomington, and serves as the Recording Head development and manufacturing arm of Seagate.

The estimated base salary range for this position is $92,310.40 - $. The individual salary is based on work location and additional factors, including job‑related skills, experience, and relevant education or training.

Seagate offers comprehensive benefits to its eligible employees, including, but not limited to, eligibility to participate in discretionary bonus program, medical, dental, vision, and life insurance, short‑and long‑term disability, 401(k), employee stock purchase plan, health savings account, dependent care, and healthcare spending accounts. Seagate also offers paid time off, including 12 holidays, flexible time off provided pursuant to Seagate policy, a minimum of 48 hours of paid sick leave, and 16 weeks of paid parental leave.

The benefits for this position are based on a full‑time schedule for a full calendar year and may differ depending on work location.

Location: Normandale, United States

Travel: Up to 10%