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AI ​/ Simulation Engineer (Thermal - Electronics Cooling

Job in Bluefield, Mercer County, West Virginia, 24704, USA
Listing for: Saur Energy International
Full Time position
Listed on 2026-08-22
Job specializations:
  • Engineering
    Energy Engineer, Mechanical Engineer, Test Engineer, Systems Engineer
Salary/Wage Range or Industry Benchmark: 70000 - 100000 USD Yearly USD 70000.00 100000.00 YEAR
Job Description & How to Apply Below
Position: AI / Simulation Engineer (Thermal - Electronics Cooling)
  • Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer
  • Support component-, board-, enclosure-, cabinet-, and sub-system–level thermal analysis for products such as circuit breakers, PLCs, laptops, and appliances
  • Analyze industrial environments (EIA) including high ambient temperatures, enclosure heating, dust effects, and derating requirements
  • Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs
  • Apply appropriate boundary conditions including power losses (I²R, switching losses), contact resistance, and environmental loads
  • Support steady-state and transient thermal analyses, including power cycling, duty cycles, startup conditions, and basic fault scenarios
  • Evaluate airflow distribution in control panels, switch gear assemblies, and electronic enclosures
  • Post-process and interpret simulation results to identify thermal risks, hotspots, airflow inefficiencies, and design improvement opportunities
  • Assist in correlating simulation results with temperature rise tests, lab measurements, and field observations
  • Prepare clear technical summaries and documentation of assumptions, methods, results, and limitations
  • Support verification and validation (V&V) activities, including comparison with test data using engineering metrics
  • Engage with senior engineers to understand UL/IEC standards, certification requirements, and temperature rise limits
  • Learn and apply best practices in mesh strategy, numerical stability, convergence assessment, and result credibility
  • Support design optimization activities such as heat sink sizing, airflow path improvement, and enclosure ventilation strategies
  • Collaborate effectively with cross-functional teams (electrical, mechanical, regulatory) and contribute to a learning-oriented, supportive team culture
Responsibilities
  • Develop and execute Computational Fluid Dynamic (CFD) and thermal simulations for electronics cooling applications, including airflow, forced and natural convection, and conjugate heat transfer
  • Support component-, board-, enclosure-, cabinet-, and sub-system–level thermal analysis for products such as circuit breakers, PLCs, laptops, and appliances
  • Analyze industrial environments (EIA) including high ambient temperatures, enclosure heating, dust effects, and derating requirements
  • Assist in rapid model setup and simulation turnaround to support internal service requests and customer engineering needs
  • Apply appropriate boundary conditions including power losses (I²R, switching losses), contact resistance, and environmental loads
  • Support steady-state and transient thermal analyses, including power cycling, duty cycles, startup conditions, and basic fault scenarios
  • Evaluate airflow distribution in control panels, switch gear assemblies, and electronic enclosures
  • Post-process and interpret simulation results to identify thermal risks, hotspots, airflow inefficiencies, and design improvement opportunities
  • Assist in correlating simulation results with temperature rise tests, lab measurements, and field observations
  • Prepare clear technical summaries and documentation of assumptions, methods, results, and limitations
  • Support verification and validation (V&V) activities, including comparison with test data using engineering metrics
  • Engage with senior engineers to understand UL/IEC standards, certification requirements, and temperature rise limits
  • Learn and apply best practices in mesh strategy, numerical stability, convergence assessment, and result credibility
  • Support design optimization activities such as heat sink sizing, airflow path improvement, and enclosure ventilation strategies
  • Collaborate effectively with cross-functional teams (electrical, mechanical, regulatory) and contribute to a learning-oriented, supportive team culture
Advertisment Qualifications
  • Bachelor’s or Master’s degree in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, or a related field from a reputed institution
  • 4–8 years of industrial or applied experience in Computational Fluid Dynamic (CFD) and…
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