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Mechanical Engineer III - Thermal Analysis

Job in Bohemia, Suffolk County, New York, 11716, USA
Listing for: North Atlantic Industries
Full Time position
Listed on 2026-02-16
Job specializations:
  • Engineering
    Manufacturing Engineer, Mechanical Engineer, Systems Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 60000 - 80000 USD Yearly USD 60000.00 80000.00 YEAR
Job Description & How to Apply Below

Description

North Atlantic Industries is a leading provider of embedded electronic solutions, specializing in rugged embedded computing, power supplies and motion simulation and measurement technologies. Our products and services are used by the military, aerospace, and industrial markets, helping to advance technology and protect the free world.

Summary

The Mechanical Engineer III develops advanced military-grade embedded systems and packaging, with a strong focus on thermal solution design and PCB thermal management for rugged electronics in aerospace and defense applications. They bring over 10 years of hands-on experience in electronics packaging and mechanical design for high-reliability environments.

Responsibilities

  • Leadership
    • Work closely with cross functional teams to develop new products.
    • Reviews project progress with management to ensure that the product meets design goals and timeline.
    • Train and mentor one or more junior engineers, fostering their growth.
  • Mechanical Design
    • Design packaging for electronic components like printed circuit boards, connectors, cables for use in rugged environments including laboratory, terrestrial and aerospace applications.
    • Plan and collaborate with the electrical engineering team to create multiple variations of existing and new products.
    • Ensure the new design will survive in rugged environments.
    • Provide mechanical packaging concept and feasibility study at proposal stage.
    • Design thermal management solutions for electronic components.
    • Create detailed drawings for fabrication purposes.
    • Perform tolerance studies to ensure worst case conditions do not impede performance.
    • Develop and validate custom thermal management solutions for printed circuit boards, including heat pipe integration, conduction/convection cooling, and thermal interface material selection.
    • Perform PCB thermal analysis efforts to ensure high-reliability operation in extreme environments.
  • Mechanical Analysis
    • Perform printed circuit board level and system level structural analysis and fatigue analysis.
    • Perform printed circuit board level and system level thermal analysis for conduction and convection cooled products.
  • Prototype And Testing
    • Lead the mechanical engineering design process, from concept to prototype through testing and troubleshooting.
    • Develop product test plans for both informal and formal design testing.
  • Manufacturing Support
    • Experience in Design for Manufacturability and Assembly (DFM/DFMA).
    • Strong drafting skills with experience/knowledge in assembly tooling, fixture design.
    • Support new design handoff to production environment.

Qualifications And Education Requirements

  • Strong working knowledge of packaging electrical components like printed circuit boards, connectors, cables in rugged environments including ground and aerospace applications.
  • A bachelor’s degree in mechanical engineering (BSME) required, with a strong understanding of electronics packaging concepts.
  • 10 years of experience in an engineering and manufacturing environment.
  • Proven experience in solving packaging challenges for printed board assembly designs in demanding ground and aerospace environments.
  • Demonstrated CAD proficiency, particularly in Autodesk Inventor or Solidworks and ASME Y14.5-2018 and GD&T standards.
  • Demonstrated knowledge of strength of materials, vibration, and fatigue. Ability to analyze and understand results and implement design changes to improve structural performance of electronic systems. This includes proficiency in FEA software, particularly ANSYS Mechanical, to perform modal, random vibration, shock, and other structural analyses.
  • Demonstrated knowledge of heat transfer mechanisms and principles to analyze, understand results and implement design changes to improve thermal performance of electronic systems. This includes familiarity with Autodesk CFD software package or similar, to perform conduction and convection thermal analyses.
  • Ability to multitask effectively in a work environment with shifting priorities.
  • Excellent oral, written, and interpersonal skills.
  • Candidates must be a U.S. Person, defined as either a U.S. citizen or a lawful permanent resident (Green Card holder), and must be able to provide…
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