Wafer Bond Process Development Engineer

Overview

Our vision to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is looking for experienced process engineers with experience in wafer bonding, photolithography, wet process, thin films, wafer thinning (grind and CMP).

As a process engineer in the Wafer Bonding team, you will be primarily responsible for developing process technology which will enable wafer bonding performance to meet the requirements for the DRAM roadmap. You will work with the process integration, process engineering, equipment, and manufacturing teams to develop and implement solutions. At Micron, we value People, Innovation, Tenacity, Collaboration and Customer Focus.

Ideal Candidates will seek to use those values to guide their work. We tackle challenging tactical and technical problems to meet the demands of our fast-paced and dynamic development environment. You will be working in a highly collaborative atmosphere, interacting with various groups to ensure robust solutions that meet the detailed physical and electrical requirements for Micron products. You will grow into an expert engineer, driving roadmaps, which have a direct influence on Micron’s global leadership in semiconductor manufacturing.

• Rigorous process ownership which includes new process development and sustaining of your current process.
• Collaborating with Equipment teams, Process Development and Process Integration to develop innovative process engineering solutions.
• Optimizing processes and equipment to reduce cost, process variability, and improve process capability.
• Strong logic and problem-solving skills and thought processes based on model-based problem solving.
• Mature understanding of the process flow related to area equipment, SPC principles, and recipe management.

• Bachelor of Science + 3yrs experience or Master of Science / PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields or relevant experience
• Hands-on experience with wafer bonding
• Knowledge of DRAM, or other memory.
• Ability to communicate effectively and efficiently to a variety of audiences

• Hands on experience with wafer bonding, photolithography, wet process, thin films, wafer thinning (grind and CMP).
• Strong leadership skills with the shown ability to coordinate efforts across a variety of groups
• Able to efficiently organize multifunctional teams to complete projects on time
• Strong teamwork skills

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.

Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work see the Micron Careers site. To learn more about Micron, please visit Micron’s careers page. For US sites only:
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