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Wafer Bonding Process Engineer — Innovate & Lead

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology
Full Time position
Listed on 2026-02-16
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Software Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below
A global leader in memory and storage solutions is seeking an experienced Process Engineer in Boise,  successful candidate will develop and implement innovative process engineering solutions for wafer bonding. This role demands a strong understanding of process flows and collaboration with multiple teams to optimize processes. Ideal candidates will have a Bachelor’s degree with 3+ years of relevant experience and hands-on wafer bonding expertise.

The position offers a dynamic and collaborative work environment with great opportunities for professional growth.
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