Process Integration Engineer | APTD

Position Overview

As a Process Integration Engineer within APTD your responsibilities include but are not limited to developing and enabling deployment of advanced interconnect technologies. Successful development and deployment will ensure that products which use the developed technologies meet performance, cost, manufacturability, quality, reliability and schedule requirements. Also, you will have responsibility to work with peers and internal partners across organizations to coordinate the development and launch of new technologies and integration flows.

• This role is open to candidates at Process Engineer Levels 2, 3, or 4.
• Work with peers, internal teams and external suppliers to develop new technology / capabilities required for innovative packaging solutions.
• Provide innovative and efficient advanced packaging solutions on time and with best predictable reliability performance.
• Work with peers to establish project timelines and verification of work needed to validate new technology.
• Ensure smooth transition from new product development, qualification, small volume production to high volume production.
• Understand future trends, technology and capabilities required for future advanced packaging solutions.
• Work with peers and internal teams to define future roadmaps.
• Continually grow your own technical and management skills and pursue continued education.
• Encourage and enforce safe, compliant behavior through periodic communications and the performance management process.
• Maintain area procedures and training required to ensure legal compliance and conformance to management system.
• Support internal and external audits.

• 3+ years of professional experience in the semiconductor industry.
• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating senior‑level technical capability.
• Professional experience in process integration, process development, advanced packaging, or closely related semiconductor technology domains within an R&D environment (IDM, foundry, OSAT, or equivalent).

• End‑to‑end ownership of integration solutions, including technology definition, process development, qualification, and successful transfer to high‑volume manufacturing.
• Deep, practical expertise in advanced packaging and interconnect technologies, such as 2.5D and 3
  
  DIC integration, wafer‑level and fan‑out packaging, wirebond, microbump, and/or hybrid bonding.
• Semiconductor technology background, with experience in memory (DRAM, NAND) and/or logic.
• Demonstrated strength in process integration problem‑solving, including Design of Experiments (DoE) and data‑driven decision making.
• Root‑cause analysis and decision‑making methodologies (e.g., KT or equivalent).

Micron provides a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.