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Principal Equipment Development Engineer Boise, Idaho, Posted

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-05-03
Job specializations:
  • Engineering
    Systems Engineer, Manufacturing Engineer, Electrical Engineering, Materials Engineer
Salary/Wage Range or Industry Benchmark: 110000 - 150000 USD Yearly USD 110000.00 150000.00 YEAR
Job Description & How to Apply Below
Position: Principal Equipment Development Engineer Boise, Idaho, United States of America Posted a day ago
** Our vision is to transform how the world uses information to enrich life for
* all*.
** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your

To learn more about Micron, please visit

For US Sites Only:
To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at  hrsupport or (select option #3)
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert**:
** Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert:
Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Advanced Packaging Technology Development is where we build the future of memory. We work hands‐on with equipment, suppliers, and manufacturing teams to turn new ideas into factory‐ready solutions. If you enjoy solving complex technical problems at scale and shaping how technology comes together, you’ll find real impact here.

This role is a senior equipment technical leader supporting advanced packaging development. You’ll guide sophisticated equipment programs that enable next‐generation bonding, thinning, inspection, and assembly processes. Your work will influence technology readiness, supplier roadmaps, and manufacturing success across global sites.
** Responsibilities:
*** Lead equipment development programs supporting advanced packaging processes and platforms
* Serve as a technical authority for assigned equipment or capability areas within APTD
* Drive improvements in equipment capability, reliability, cost, and manufacturability
* Own technical execution from roadmap definition through risk management and delivery
* Partner across process, integration, manufacturing, and suppliers to deliver aligned outcomes
*
* Minimum Qualifications:

*** Master’s degree or PhD in Mechanical, Electrical, Materials, Chemical Engineering, Physics, or a related field
* 10+ years of experience in semiconductor equipment engineering, advanced packaging, or technology development
* Proven principal‐level technical leadership on complex, cross‐functional programs
* Strong ability to communicate technical status, risks, and recommendations to senior leadership
* Demonstrated influence without authority across teams and sites
*
* Preferred Qualifications:

*** Experience with advanced packaging technologies such as HBM, wafer‐ or die‐level bonding, TSV, RDL, or thinning
* Background in FOAK equipment development or high‐risk technology enablement
* Experience leading joint development efforts with equipment suppliers

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.  We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.  

Micron also provides…
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