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Principal Engineer, Advanced Packaging 5D​/3D Innovation Leader

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology
Full Time position
Listed on 2026-05-14
Job specializations:
  • Engineering
    Packaging Engineer, Product Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 125000 USD Yearly USD 100000.00 125000.00 YEAR
Job Description & How to Apply Below
Position: Principal Engineer, Advanced Packaging - 2.5D/3D Innovation Leader
Micron Technology is looking for a Principal Engineer in Boise, Idaho. This position plays a crucial role in advancing semiconductor packaging technologies. You will identify and resolve process-related issues, coordinate evaluations, and lead technical teams to enhance product quality and cost efficiency. A suitable candidate should have over 5 years of experience in advanced packaging and a relevant degree. Micron offers comprehensive health benefits and substantial paid time off.
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