More jobs:
Senior Packaging Architect: .5D/3D IC Innovation
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-05-14
Listing for:
Micron Technology, Inc.
Full Time
position Listed on 2026-05-14
Job specializations:
-
Engineering
Packaging Engineer, Systems Engineer
Job Description & How to Apply Below
A leading semiconductor company in Boise is seeking a Principal Engineer to shape next-generation semiconductor packaging technologies. You will play a key role in guiding the packaging technology roadmap, mentoring engineers, and driving innovation. Ideal candidates should have extensive experience in advanced packaging, particularly with High Bandwidth Memory and process module engineering.
This role offers competitive benefits and a collaborative working environment.
#J-18808-Ljbffr
Position Requirements
10+ Years
work experience
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
Search for further Jobs Here:
×