×
Register Here to Apply for Jobs or Post Jobs. X

Process Integration Lead, APTD

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology
Full Time position
Listed on 2026-05-16
Job specializations:
  • Engineering
    Process Engineer, Manufacturing Engineer, Materials Engineer
Salary/Wage Range or Industry Benchmark: 80000 - 100000 USD Yearly USD 80000.00 100000.00 YEAR
Job Description & How to Apply Below

Our Vision

Our vision is to transform how the world uses information to enrich life for all.

Department Intro

At Micron Technology, the Technology Development (TD) department drives innovation in memory and storage solutions. The team develops processes and technologies for next‑generation semiconductor products. By collaborating with global R&D and manufacturing groups, they ensure efficient transfer and implementation of new technology nodes. Their work sustains Micron's industry leadership.

Position Overview

As a Process Integration Lead in the Advanced Packaging Technology Development (APTD) team, you will lead a team of experienced engineers developing advanced wafer‑level and die‑level interconnect technologies. You will ensure targeted products meet performance, cost, manufacturability, quality, reliability, and schedule requirements. You will also work with peers and internal partners across organizations to coordinate the transfer of new integration flows to High‑Volume Manufacturing (HVM) sites.

You will be recognized as an authority in broader integration areas by peers in the manufacturing and technology development organizations. You will need to advise and lead the work of others and ensure good communication, engagement and accountability leading to the achievement of the program goals. You must be adept at accepting change and volatility and operate with a sense of urgency.

Apply sound engineering principles and judgment, seek advice from authorities, and make critical and timely decisions.

Responsibilities
  • Drive process innovation to deliver high‑impact, scalable technology solutions.
  • Define and integrate highly sophisticated, vertically aligned process flows.
  • Develop innovative solutions and establish robust contingency plans.
  • Define and complete the Compose of Experiments (CoE) using data‑driven methodologies.
  • Apply structured problem‑solving and decision‑making methods (Kempner‑Tregoe or equivalent).
  • Champion cost efficiency while balancing performance, quality and reliability.
  • Communicate effectively across teams, sites, and executive leadership.
  • Coach and mentor engineers and technicians while promoting a growth mindset through continuous learning and multi‑functional collaboration.
Required Experience
  • Over 10 years of professional experience within the semiconductor industry.
  • MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a closely related field, or equivalent professional experience demonstrating senior‑level technical capability.
  • Professional experience in process integration, process development, advanced packaging or closely related semiconductor technology domains within an R&D environment (IDM, foundry, OSAT, or equivalent).
Preferred Qualifications
  • Professional experience in process integration, process development, advanced packaging or similar semiconductor technology areas within an R&D environment (IDM, foundry, OSAT, or equivalent).
  • Proven end‑to‑end ownership of integration solutions, including technology definition, process development, qualification and transfer to high‑volume manufacturing.
  • Deep, hands‑on experience with advanced packaging and interconnect technologies, including 2.5D/3

    DIC integration; wafer‑level and fan‑out packaging; and wirebond, microbump and/or hybrid bonding.
  • Proven record of direct technical ownership of solutions (hands‑on execution encouraged; oversight‑only experience is insufficient).
  • Strong semiconductor technology background with experience in memory (DRAM, NAND) and/or logic devices.
  • Ability to thrive in fast‑paced, ambiguous R&D settings through robust process integration problem‑solving abilities, including DoE, data‑driven decision‑making, root‑cause analysis and structured approaches (e.g., KT or equivalent).
Equal‑Opportunity Employment Statement

Micron is proud to be an equal‑opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state or local laws.

#J-18808-Ljbffr
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)
0
200
Filters
Education Level
Experience Level (years)
Posted in last:
Salary