Principal EUV Mask Technology R&D Engineer Boise, Idaho, Posted

Position: Principal EUV Mask Technology R&D Engineer Boise, Idaho, United States of America Posted a day ago
## Principal EUV Mask Technology R&D Engineer Boise, Idaho, United States of America
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At Micron’s Mask Technology Center (MTC), we develop the materials, films, and processes that enable next‐generation EUV lithography. We collaborate across materials science, lithography, OPC, and high‐volume manufacturing to solve some of the most exciting challenges in advanced DRAM scaling. We are a hands‐on, innovative team working on technology that shapes the future of High‐NA  this role, you will lead R&D for next‐generation EUV mask materials and processes, driving readiness for High‐NA EUV manufacturing.

You will guide roadmap strategy, partner with world‐class engineering teams and suppliers, and develop solutions that translate complex lithography requirements into manufacturable, reliable mask technologies.
** Responsibilities:
*** Lead development of EUV mask blank materials and mask processes, including film stack design, deposition, etch, clean, and patterning quality
* Drive High‐NA EUV readiness through material selection, mask design, stitching, lithography performance, and lifetime improvement
* Translate lithography requirements into manufacturable mask solutions in partnership with OPC, design, and lithography teams
* Lead data‐driven R&D using DOE and fundamental analysis to improve yield, reliability, and manufacturability
* Mentor engineers and transition developed technologies to FEOL process engineering teams
*
* Minimum Qualifications:

*** MS or PhD in Materials Science, Physics, Chemistry, Chemical Engineering, or related field
* Hands‐on experience with EUV mask technology, thin films, materials, or process characterization
* Strong problem‐solving skills and demonstrated innovation in semiconductor manufacturing
* Ability to communicate technical concepts clearly across R&D, manufacturing, and supplier teams
*
* Preferred Qualifications:

*** Experience with High‐NA EUV, mask characterization, or mask reliability
* Background in mask material analysis, film stack simulation, or mask lifetime improvement
* Experience collaborating with equipment or blank suppliers on advanced technology development
* Familiarity with roadmap planning or defining tool/process capability requirements

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