Senior​/HBM PYE Product Development Failure Analysis Engineer

Senior/Staff HBM PYE Product Development Failure Analysis Engineer

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. As an HBM Product Yield Enhancement PDFA Engineer, you will work on the Product Development Failure Analysis team to take next‑generation HBM devices from design to mass production, focusing on product reliability and component failure analysis at new HBM product introductions to enable rapid production ramp and early time‑to‑market.

• Perform electrical and statistical failure analysis to understand failure mechanisms.
• Identify causes of component failures through data analysis.
• Work closely with partner engineering teams to resolve fabrication and assembly process defect–related issues and test flow marginalities.
• Use AI and statistical tools for detailed data analysis to improve component performance.

• 3+ years of experience using electrical and statistical failure analysis to understand failure mechanisms.
• 3+ years of experience in the application of electrical and physical characterization techniques.
• Proven experience demonstrating analytical abilities combined with proficiency in applying statistical tools for analyzing data.
• Bachelor’s degree in Electrical or Computer Engineering, Physics, or Materials Science.

• 5+ years of experience using electrical and statistical failure analysis to understand failure mechanisms.
• 5+ years of experience in the application of electrical and physical characterization techniques.
• Advanced coursework in VLSI, device physics, semiconductor processes, Python, and statistics.
• Experience with AI tools for component failure analysis.
• Strong communication skills in a cross‑functional team environment.