×
Register Here to Apply for Jobs or Post Jobs. X

Lead, -Gen HBM Packaging Engineer

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: 1000 Micron Technology, Inc.
Full Time position
Listed on 2026-05-31
Job specializations:
  • Engineering
    Systems Engineer, Manufacturing Engineer
Salary/Wage Range or Industry Benchmark: 100000 - 125000 USD Yearly USD 100000.00 125000.00 YEAR
Job Description & How to Apply Below
Position: Lead, Next-Gen HBM Packaging Engineer

1000 Micron Technology, Inc. in Boise, Idaho is seeking a skilled engineer to lead product engineering activities in the HBM team. The position involves collaboration across various engineering functions, team mentorship, and ensuring project efficiency.

The ideal candidate will possess a relevant advanced degree and a significant track record in the semiconductor industry, particularly involving sophisticated packaging processes. Benefits include comprehensive health plans, paid time-off, and a supportive workplace promoting growth.

#J-18808-Ljbffr
To View & Apply for jobs on this site that accept applications from your location or country, tap the button below to make a Search.
(If this job is in fact in your jurisdiction, then you may be using a Proxy or VPN to access this site, and to progress further, you should change your connectivity to another mobile device or PC).
 
 
 
Search for further Jobs Here:
(Try combinations for better Results! Or enter less keywords for broader Results)
Location
Increase/decrease your Search Radius (miles)
0
200
Filters
Education Level
Experience Level (years)
Posted in last:
Salary