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Lead, -Gen HBM Packaging Engineer
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-05-31
Listing for:
1000 Micron Technology, Inc.
Full Time
position Listed on 2026-05-31
Job specializations:
-
Engineering
Systems Engineer, Manufacturing Engineer
Job Description & How to Apply Below
1000 Micron Technology, Inc. in Boise, Idaho is seeking a skilled engineer to lead product engineering activities in the HBM team. The position involves collaboration across various engineering functions, team mentorship, and ensuring project efficiency.
The ideal candidate will possess a relevant advanced degree and a significant track record in the semiconductor industry, particularly involving sophisticated packaging processes. Benefits include comprehensive health plans, paid time-off, and a supportive workplace promoting growth.
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