Principal Diffusion Process Development Engineer, DRAM

Principal Diffusion Process Development Engineer

You will act as a technical leader accountable for FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM devices. The position emphasizes gate dielectric scaling, process reliability, and manufacturing preparedness, requiring expertise in diffusion processes, oxidation principles, and device physics.

• Lead the progress of FEOL diffusion, thermal treatment, and gate oxidation operations in advanced DRAM technology.
• Develop and scale ultra‑thin gate dielectrics, balancing electrical performance, reliability, variability, and manufacturability.
• Own the interaction between process conditions, materials behavior, and diffusion hardware.
• Drive process development from concept through integration, pilot qualification, and manufacturing transfer.
• Evaluate, qualify, and optimize diffusion and oxidation equipment platforms and reactor builds.
• Define and monitor manufacturing metrics, including statistical process control, process capability, defectivity, and variability.
• Plan, complete, and analyze built experiments, and clearly detail technical results.
• Interpret electrical, physical, and materials characterization data to guide development decisions.
• Work together with process R&D, process integration, device engineering, equipment engineering, and manufacturing.
• Partner with external suppliers to develop hardware and processes aligned with future technology needs.
• Generate intellectual property and technical documentation supporting process innovation.
• Act as a technical subject‑matter expert, supporting engineers who are developing their skills as needed.

• PhD in Chemical Engineering, Materials Science, Chemistry, Physics, Electrical Engineering, or a closely related field with 4+ years of experience.
• Strong background in device physics, particularly MOS device behavior.
• Extensive knowledge of diffusion and oxidation principles, including thermal processing and reaction kinetics, dopant behavior and activation, interface and defect control.
• Practical experience working with diffusion and oxidation equipment in laboratory or cleanroom settings.
• Demonstrated experience scaling processes to manufacturing readiness, including SPC and process control.
• Strong analytical skills and ability to extract insight from complex datasets.
• Excellent written and verbal communication skills.

• Experience in gate dielectric reduction within advanced DRAM and/or logic technologies.
• Familiarity with FEOL integration challenges, including variability and reliability considerations.
• Experience with characterization techniques such as TEM, SIMS, XPS, AFM, SEM, ellipsometry, and electrical measurements.
• Proven ability to lead technical projects independently and influence cross‑functional teams.
• Experience working directly with equipment vendors on tool and process development.

• Medical, dental, and vision plans available at all locations.
• Programs to protect income in case of illness or injury.
• Paid family leave.
• Robust paid time‑off program and paid holidays.
• Additional benefit information available on the Micron benefits guide.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.