Principal Equipment Development Engineer

Req  Principal Equipment Development Engineer

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Advanced Packaging Technology Development is where we build the future of memory. We work hands‑on with equipment, suppliers, and manufacturing teams to turn new ideas into factory‑ready solutions. If you enjoy solving complex technical problems at scale and shaping how technology comes together, you’ll find real impact here.

This role is a senior equipment technical leader supporting advanced packaging development. You’ll guide sophisticated equipment programs that enable next‑generation bonding, thinning, inspection, and assembly processes. Your work will influence technology readiness, supplier roadmaps, and manufacturing success across global sites.

• Lead equipment development programs supporting advanced packaging processes and platforms
• Serve as a technical authority for assigned equipment or capability areas within APTD
• Drive improvements in equipment capability, reliability, cost, and manufacturability
• Own technical execution from roadmap definition through risk management and delivery
• Partner across process, integration, manufacturing, and suppliers to deliver aligned outcomes

• Master’s degree or PhD in Mechanical, Electrical, Materials, Chemical Engineering, Physics, or a related field
• 10+ years of experience in semiconductor equipment engineering, advanced packaging, or technology development
• Proven principal‑level technical leadership on complex, cross‑functional programs
• Strong ability to communicate technical status, risks, and recommendations to senior leadership
• Demonstrated influence without authority across teams and sites

• Experience with advanced packaging technologies such as HBM, wafer‑ or die‑level bonding, TSV, RDL, or thinning
• Background in FOAK equipment development or high‑risk technology enablement
• Experience leading joint development efforts with equipment suppliers

Job Profile(s):
Equipment Engineer 5

Relocation Level: TBD

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.