Product Engineer; Adv Pkg Pathfinding), Heterogeneous Integration Group; HIG), Bandwi

In this role, you will lead and develop a high‑performing team to drive package and HBM product engineering activities within the HBM Systems and Product Engineering team.

• Collaborate with the Advanced Package Technology team to enable sophisticated interconnect technology solutions, including wafer‑to‑wafer bonding.
• Work with the Test Solutions team to enable test solutions and provide analysis of yield and electrical characteristics data.
• Collaborate with engineering teams on electrical failure analysis and develop DFT and characteristic data for sophisticated packaging solutions.
• Work on EFA of advanced packaging failure, extracting and providing electrical and mechanical characteristics data.
• Actively mentor and develop team members to foster growth and development within the team and organization.
• Work closely with multi‑functional teams—Advanced Packaging, Design, Test Solution, and Yield Engineering—to ensure multidisciplinary development and successful enablement.
• Develop project‑management skills within the team to ensure efficient execution of projects and timely delivery of technological solutions.
• Make final decisions on risk analysis and project prioritization, directly impacting the direction of technological development.

• Bachelor's, Master's, or Ph.D. in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field.
• At least 10 years of experience in the semiconductor industry.
• Deep knowledge of sophisticated package process/integration and DRAM or other memory.
• Excellent data extraction, analysis, and reporting skills (e.g., JMP or other tools).
• Willingness to work on site in the U.S. with international travel to Singapore and Taiwan.

• Familiarity with memory testing methodology.
• Dedicated and highly motivated with a flexible approach toward adapting to different roles in a dynamic working environment, from leading the team to leading technical programs.
• Strong record of collaborative work within/across teams to address sophisticated business and engineering problems.
• Willingness to work on site in the U.S. with international travel to Singapore and Taiwan.

Micron offers a choice of medical, dental, and vision plans in all locations, allowing team members to select the plans that best meet their family healthcare needs and budget. Additional benefit programs protect income if an employee is unable to work due to illness or injury, and paid family leave is available. A robust paid time‑off program and paid holidays are also provided.

Micron is proud to be an equal‑opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.