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Senior Process Engineer: Chip-to-Wafer & Hybrid Bonding
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-05-31
Listing for:
Micron Technology, Inc
Full Time
position Listed on 2026-05-31
Job specializations:
-
Engineering
Systems Engineer
Job Description & How to Apply Below
Micron Technology, Inc in Boise, Idaho is seeking a Senior Process Engineering Technical Leader to advance chip-to-wafer and hybrid bonding processes for innovative 3D memory products. This role requires a Master’s or PhD and 13+ years of semiconductor R&D experience.
You will lead multidisciplinary efforts that bridge early development to high-volume manufacturing, ensuring product reliability and performance. The position offers comprehensive benefits including medical options, paid time off, and family leave.
Join Micron and contribute to transforming how the world uses information.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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