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MTS​/Principal Engineer, Metals Adv DRAM

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: 1000 Micron Technology, Inc.
Full Time position
Listed on 2026-05-31
Job specializations:
  • Engineering
    Process Engineer, Electrical Engineering, Materials Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 160000 USD Yearly USD 120000.00 160000.00 YEAR
Job Description & How to Apply Below

Position Summary

Micron Technology, Inc. is seeking an MTS/Principal Process Development Engineer to join its Advanced DRAM Technology Development team. The role offers ample opportunity for innovation, collaboration, and testing new dimensions in advanced DRAM. The engineer will work directly with Process Integration and related process areas—including Dry Etch, Wet Etch, CVD, Diffusion, Lithography, and CMP—and will own the process roadmap to meet program and yield goals.

Key Responsibilities
  • Technically innovate: drive strategic technical and tactical decisions at a project and platform level by contributing to feasibility studies and proactively engaging technical challenges before they become problems.
  • Key processes include vapor/plasma etching, selective wet etching, surface preparation, and high-aspect processing.
  • Maintain vision and technical skills to relate technologies and business plans across groups; actively build Micron intellectual property.
  • Lead Micron IP into successful technical readiness and transition to program integration.
  • Interact regularly with senior management to provide consultation, influence technical and strategic decisions, and craft alliances with customers.
  • Drive product planning/roadmap, platform features, and functional area strategy with a focus on scientific fundamentals.
Required Skills & Experience
  • 10+ years of experience in Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, or an equivalent field—including research during a PhD and 10 years of relevant semiconductor industry experience.
  • Subject matter expertise in low resistive metallization, lateral contact silicidation, high-aspect-ratio metal fill, wafer stress management, implantation, and solving highly complex problems with innovative solutions to new equipment modification and process research.
  • Experience leading significant projects in DRAM/NAND FEOL, MOL, CAP, wafer bonding, CMOS, and BEOL modules to support technical innovation across fabs.
  • Understanding of solid-state physics (transition metal oxides, metals, surfaces, interfaces) and challenges in materials exploration for device scaling.
  • Understanding of chemical kinetics and application to CVD, ALD, and PVD deposition processes in various reactors.
Preferred Qualifications
  • Experience in semiconductor processing or manufacturing.
  • Experience in DRAM or memory.
  • Understanding of thin-film analysis techniques such as SIMS, XPS, EDS, AFM, SEM, TEM, and XRR.
  • Incorporation of AI into daily work with emphasis on coding, automation, and/or data science.
  • Hands‑on experience on thin-film deposition equipment in a lab or cleanroom environment.
  • Proficiency in data analysis and statistical techniques and ability to evaluate large datasets for electrical and physical analysis.
Benefits

Micron provides medical, dental, and vision plans, disability income protection, paid family leave, robust paid time‑off, and paid holidays. For more details, consult the Benefits Guide on

Equal Employment Opportunity

Micron is an equal opportunity workplace and an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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