Senior Engineer - Wafer Bond & CMP Equipment Development
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-05-31
Listing for:
Micron Technology, Inc
Full Time
position Listed on 2026-05-31
Job specializations:
-
Engineering
Systems Engineer, Software Engineer, Electrical Engineering
Job Description & How to Apply Below
Micron Technology, Inc in Boise, Idaho is seeking a Sr. Engineer for CMP/Bond Equipment Development. This role involves developing and optimizing next generation wafer bond equipment and resolving equipment-related issues by applying advanced methodologies.
The candidate should have a Bachelor’s in a relevant field and 2 years of engineering experience. Micron provides comprehensive benefits, paid time off, and supports a diverse workplace.
#J-18808-LjbffrPosition Requirements
10+ Years
work experience
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