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MTS​/Principal Engineer, Metals Adv DRAM

Job in Boise, Ada County, Idaho, 83708, USA
Listing for: Micron Technology, Inc
Full Time position
Listed on 2026-05-31
Job specializations:
  • Engineering
    Electrical Engineering, Process Engineer, Materials Engineer, Electronics Engineer
Salary/Wage Range or Industry Benchmark: 120000 - 160000 USD Yearly USD 120000.00 160000.00 YEAR
Job Description & How to Apply Below

Job Overview

As a MTS/Principal Process Development Engineer, you will be part of the Advanced DRAM Technology Development team. The position offers opportunities for innovation, collaboration, and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet Etch, CVD, Diffusion, Lithography, and CMP, and will own the process roadmap to meet program and yield goals.

Key Responsibilities
  • Technically innovate by driving strategic technical and tactical decisions at project and platform levels, contributing to feasibility studies and proactively addressing technical challenges.
  • Apply expertise in vapor/plasma etching, selective wet etching, surface preparation, and high-aspect-ratio processing.
  • Develop and maintain technology vision that aligns with business plans and builds Micron intellectual property.
  • Lead the transition of technology into successful technical readiness and program integration.
  • Interact with senior management to inform technical and strategic decisions and build alliances with customers.
  • Drive product planning, roadmap, platform features, and functional area strategy with emphasis on scientific fundamentals.
Minimum Qualifications
  • 10+ years of experience in Materials Science, Physics, Chemistry, Chemical Engineering, Electrical Engineering, or an equivalent field, including research during a PhD and 10 years of semiconductor industry experience.
  • Subject matter expertise in low‑resistive metallization, lateral contact silicidation, high-aspect-ratio metal fill, wafer stress management, implantation for defect resolution, and documentation of innovative solutions for equipment modification and process research.
  • Demonstrated leadership of significant projects in DRAM/NAND FEOL, MOL, CAP, Wafer Bonding, CMOS, or BEOL modules that support technical innovation across fabs.
  • Strong understanding of solid-state physics, transition metal oxides, metals, surfaces, interfaces, and material challenges for device scaling.
  • Knowledge of chemical kinetics applied to CVD, ALD, and PVD deposition processes in various reactors.
Preferred Qualifications
  • Experience in semiconductor processing or manufacturing, with a preference for DRAM or memory backgrounds.
  • Familiarity with thin‑film analysis techniques such as SIMS, XPS, EDS, AFM, SEM, TEM, and XRR.
  • Experience incorporating AI into daily work, including coding, automation, and data science.
  • Hands‑on experience with thin‑film deposition equipment in a lab or clean‑room environment.
  • Proficiency in data analysis and statistical techniques, evaluating large datasets to derive insightful inferences.
Job Profile

Semiconductor Process Engineer 5

Relocation Level

TBD

Benefits

Micron offers a comprehensive benefits package including medical, dental, and vision plans, income protection programs, paid family leave, paid time‑off, and paid holidays. Additional information can be found in the Benefits Guide posted on Micron’s Site.

Equal Opportunity

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity, or any other factor protected by applicable federal, state, or local laws.

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