Principal Engineer, Advanced Packaging — Lead .5D/3D Tech
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-05-31
Listing for:
1000 Micron Technology, Inc.
Full Time
position Listed on 2026-05-31
Job specializations:
-
Engineering
Systems Engineer, Packaging Engineer, Manufacturing Engineer
Job Description & How to Apply Below
1000 Micron Technology, Inc. is looking for a Principal Engineer to enhance semiconductor packaging technologies. Based in Boise, the role involves leading projects and solving complex assembly issues using advanced methodologies.
Candidates should have over 5 years of experience in semiconductor packaging and a relevant degree. Benefits include comprehensive health plans and generous paid leave. Join us to shape the future of memory solutions!
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