More jobs:
Lead Engineer, Advanced Packaging & 3D Integration
Job in
Boise, Ada County, Idaho, 83708, USA
Listed on 2026-06-01
Listing for:
Micron Technology, Inc
Full Time
position Listed on 2026-06-01
Job specializations:
-
Engineering
Packaging Engineer, Systems Engineer
Job Description & How to Apply Below
Micron Technology, Inc in Boise is seeking a Principal Engineer to lead the APTD team in shaping next-generation semiconductor packaging technologies. This position is vital for influencing product quality and reliability.
Ideal candidates will have 5+ years of experience in semiconductor advanced packaging and a relevant degree. The role involves collaboration, mentoring, and driving innovation in an exciting, fast-paced environment.
Micron offers comprehensive benefits, supporting the well-being and future preparation of its employees.
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